Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

Hendrikus Tilmans (Inventor), Eric Beyne (Inventor), Henri Jansen (Inventor), Walter De Raedt (Inventor)

    Research output: Patent

    7 Downloads (Pure)

    Abstract

    An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.
    Original languageEnglish
    Patent numberEP20020076528
    Publication statusSubmitted - 18 Apr 2002

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  • Cite this

    Tilmans, H., Beyne, E., Jansen, H., & De Raedt, W. (2002). Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules. Manuscript submitted for publication. (Patent No. EP20020076528).