Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

Hendrikus Tilmans (Inventor), Eric Beyne (Inventor), Henri Jansen (Inventor), Walter De Raedt (Inventor)

    Research output: Patent

    6 Downloads (Pure)

    Abstract

    An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.
    Original languageEnglish
    Patent numberEP20020076528
    Publication statusSubmitted - 18 Apr 2002

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    millimeter waves
    modules
    microwaves
    fabrication
    metals
    manufacturing

    Cite this

    Tilmans, H., Beyne, E., Jansen, H., & De Raedt, W. (2002). Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules. Manuscript submitted for publication. (Patent No. EP20020076528).
    Tilmans, Hendrikus (Inventor) ; Beyne, Eric (Inventor) ; Jansen, Henri (Inventor) ; De Raedt, Walter (Inventor). / Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules. Patent No.: EP20020076528.
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    title = "Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules",
    abstract = "An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.",
    author = "Hendrikus Tilmans and Eric Beyne and Henri Jansen and {De Raedt}, Walter",
    year = "2002",
    month = "4",
    day = "18",
    language = "English",
    type = "Patent",
    note = "EP20020076528",

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    Tilmans, H, Beyne, E, Jansen, H & De Raedt, W 2002, Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules, Patent No. EP20020076528.

    Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules. / Tilmans, Hendrikus (Inventor); Beyne, Eric (Inventor); Jansen, Henri (Inventor); De Raedt, Walter (Inventor).

    Patent No.: EP20020076528.

    Research output: Patent

    TY - PAT

    T1 - Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

    AU - Tilmans, Hendrikus

    AU - Beyne, Eric

    AU - Jansen, Henri

    AU - De Raedt, Walter

    PY - 2002/4/18

    Y1 - 2002/4/18

    N2 - An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.

    AB - An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.

    M3 - Patent

    M1 - EP20020076528

    ER -

    Tilmans H, Beyne E, Jansen H, De Raedt W, inventors. Fabrication of integrated tunable/switchable passive microwave and millimeter wave modules. EP20020076528. 2002 Apr 18.