TY - JOUR
T1 - Fabrication of microfluidic networks with integrated electrodes
AU - Hermes, D.C.
AU - Heuser, T.
AU - van der Wouden, E.J.
AU - Gardeniers, Johannes G.E.
AU - van den Berg, Albert
N1 - 10.1007/s00542-005-0033-7
PY - 2006/3
Y1 - 2006/3
N2 - In this paper a method is presented for the fabrication of micro-channel networks in glass with integrated and insulated gate electrodes to control the zeta-potential at the insulator surface and therewith the electro-osmotic flow (EOF). The fabrication of the electrodes is a sequence of photolithography, etching and thin film deposition steps on a glass substrate, followed by chemical mechanical polishing (CMP) and subsequently direct thermal bonding to a second glass plate to form closed micro-channels. Plasma enhanced chemical vapor deposition (PECVD) $SiO_2$ layers as insulating material between the electrodes and micro-channels and different electrode materials are examined with respect to a high bonding temperature to obtain an optimal insulating result. A CMP process for the reduction of the $SiO_2$ topography and roughness is studied and optimized in order to obtain a surface that is smooth enough to be directly bondable to a second glass plate.
AB - In this paper a method is presented for the fabrication of micro-channel networks in glass with integrated and insulated gate electrodes to control the zeta-potential at the insulator surface and therewith the electro-osmotic flow (EOF). The fabrication of the electrodes is a sequence of photolithography, etching and thin film deposition steps on a glass substrate, followed by chemical mechanical polishing (CMP) and subsequently direct thermal bonding to a second glass plate to form closed micro-channels. Plasma enhanced chemical vapor deposition (PECVD) $SiO_2$ layers as insulating material between the electrodes and micro-channels and different electrode materials are examined with respect to a high bonding temperature to obtain an optimal insulating result. A CMP process for the reduction of the $SiO_2$ topography and roughness is studied and optimized in order to obtain a surface that is smooth enough to be directly bondable to a second glass plate.
KW - EWI-7590
KW - IR-51045
KW - METIS-238240
U2 - 10.1007/s00542-005-0033-7
DO - 10.1007/s00542-005-0033-7
M3 - Article
SN - 0946-7076
VL - 12
SP - 436
EP - 440
JO - Microsystem technologies
JF - Microsystem technologies
IS - 2/5
ER -