Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding

D.C. Hermes, T. Heuser, E.J. van der Wouden, Johannes G.E. Gardeniers, Albert van den Berg

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	Undefined
Title of host publication	Workshop on wafer bonding for MEMS technologies
Place of Publication	Halle, Germany
Pages	63-64
Number of pages	2
Publication status	Published - 11 Oct 2004
Event	Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004 - Halle, Germany Duration: 11 Oct 2004 → 12 Oct 2004

Conference	Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004
Abbreviated title	WBW-MEMS
Country/Territory	Germany
City	Halle
Period	11/10/04 → 12/10/04

Keywords

@inproceedings{17ef599917d94141be6018f4d8624276,

title = "Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding",

keywords = "METIS-218782, IR-47846",

author = "D.C. Hermes and T. Heuser and {van der Wouden}, E.J. and Gardeniers, {Johannes G.E.} and {van den Berg}, Albert",

year = "2004",

month = oct,

day = "11",

language = "Undefined",

pages = "63--64",

booktitle = "Workshop on wafer bonding for MEMS technologies",

note = "Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004 ; Conference date: 11-10-2004 Through 12-10-2004",

}

Hermes, DC, Heuser, T, van der Wouden, EJ, Gardeniers, JGE & van den Berg, A 2004, Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding. in Workshop on wafer bonding for MEMS technologies. Halle, Germany, pp. 63-64, Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004, Halle, Saxony-Anhalt, Germany, 11/10/04.

Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding. / Hermes, D.C.; Heuser, T.; van der Wouden, E.J. et al.
Workshop on wafer bonding for MEMS technologies. Halle, Germany, 2004. p. 63-64.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding

AU - Hermes, D.C.

AU - Heuser, T.

AU - van der Wouden, E.J.

AU - Gardeniers, Johannes G.E.

AU - van den Berg, Albert

PY - 2004/10/11

Y1 - 2004/10/11

KW - METIS-218782

KW - IR-47846

M3 - Conference contribution

SP - 63

EP - 64

BT - Workshop on wafer bonding for MEMS technologies

CY - Halle, Germany

T2 - Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004

Y2 - 11 October 2004 through 12 October 2004

ER -