Fabrication of microfluidic networks with integrated electrodes, using CMP and glass-to-SiO2 thermal wafer bonding

D.C. Hermes, T. Heuser, E.J. van der Wouden, Johannes G.E. Gardeniers, Albert van den Berg

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageUndefined
Title of host publicationWorkshop on wafer bonding for MEMS technologies
Place of PublicationHalle, Germany
Pages63-64
Number of pages2
Publication statusPublished - 11 Oct 2004
EventWafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004 - Halle, Germany
Duration: 11 Oct 200412 Oct 2004

Conference

ConferenceWafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004
Abbreviated titleWBW-MEMS
CountryGermany
CityHalle
Period11/10/0412/10/04

Keywords

  • METIS-218782
  • IR-47846

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