Fabrication of multi-layer substrates for high aspect ratio single crystalline microstructures

C. Gui, Meint J. de Boer, Johannes G.E. Gardeniers, Henricus V. Jansen, Johan W. Berenschot, Michael Curt Elwenspoek

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Abstract

This paper reports a new method for making multi-layer substrates (MLS) for high aspect ratio single crystalline movable microstructures using a group of technologies, such as direct wafer bonding (DWB), chemical mechanical polishing (CMP), and reactive ion etching (RIE). As a first example, Si-SiO2-polySi-SiO2-Si sandwich wafers were fabricated using CMP and DWB. Subsequently, free-standing micro cantilever beams and double side clamped bridges were fabricated on these sandwich wafers using a one-run self-aligned RIE process, where polysilicon was used as the sacrificial layer. Polishing and bonding of low pressure chemical vapour deposition (LPCVD) polysilicon were studied. An LPCVD Si3+xN4 polishing stop layer technique was presented to accurately control the final thickness of the device layer. The uniformity of the device layer was improved as well. © 1998 Elsevier Science S.A. All rights reserved.
Original languageEnglish
Pages (from-to)61-66
Number of pages6
JournalSensors and actuators. A: Physical
Volume70
Issue number1-2
DOIs
Publication statusPublished - 1 Oct 1998

Keywords

  • EWI-13369
  • IR-55976

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