TY - JOUR
T1 - Fabrication of nanomechanical optical devices with aligned wafer bonding
AU - Gui, C.
AU - Veldhuis, G.J.
AU - Koster, T.M.
AU - Lambeck, Paul
AU - Berenschot, Johan W.
AU - Gardeniers, Johannes G.E.
AU - Elwenspoek, Michael Curt
PY - 1999/2
Y1 - 1999/2
N2 - This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.
AB - This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.
KW - METIS-112075
KW - IR-15200
KW - EWI-13224
U2 - 10.1007/s005420050153
DO - 10.1007/s005420050153
M3 - Article
SN - 0946-7076
VL - 5
SP - 138
EP - 143
JO - Microsystem technologies
JF - Microsystem technologies
IS - 5
ER -