Fabrication of nanomechanical optical devices with aligned wafer bonding

C. Gui, G.J. Veldhuis, T.M. Koster, Paul Lambeck, Johan W. Berenschot, Johannes G.E. Gardeniers, Michael Curt Elwenspoek

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This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.
Original languageUndefined
Pages (from-to)138-143
Number of pages6
JournalMicrosystem technologies
Issue number5
Publication statusPublished - Feb 1999


  • METIS-112075
  • IR-15200
  • EWI-13224

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