Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips

Rolf Vermeer, Johan W. Berenschot, Edin Sarajlic, Niels Roelof Tas, Henricus V. Jansen

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)
1 Downloads (Pure)

Abstract

In this paper we present the wafer-scale fabrication of molded AFM probes with high aspect ratio ultra-sharp three-plane silicon nitride tips. Using $\langle$111$\rangle$ silicon wafers a dedicated process is developed to fabricate molds in the silicon wafer that have a flat triangular bottom surface enclosed by three \{111\} side planes. By conformally coating the mold with a sufficient thick layer, the mold is sharpened, removing the flat bottom surface in the silicon mold, leaving a mold ending in three \{111\} side planes, which always intersect in a point. This ultimately results in AFM probes with tetrahedral tips consisting of three planes, thus the tips have ultra sharp apexes. We used silicon nitride to mold the probes in order to obtain more wear resistant probes compared with commonly used silicon. Inspection of the fabricated tips shows a tip radius of less than 4 nm.
Original languageUndefined
Title of host publicationProceedings of the 14th IEEE International Conference on Nanotechnology
Place of PublicationUSA
PublisherIEEE
Pages229-233
Number of pages5
ISBN (Print)978-1-4799-4082-0
DOIs
Publication statusPublished - Aug 2014
Event14th IEEE International Conference on Nanotechnology, NANO 2014 - Toronto, Canada
Duration: 18 Aug 201421 Aug 2014

Publication series

Name
PublisherIEEE

Conference

Conference14th IEEE International Conference on Nanotechnology, NANO 2014
Period18/08/1421/08/14
Other18-21 August 2014

Keywords

  • EWI-25046
  • TST-FABRICATION
  • Nanocharacterization
  • METIS-306020
  • IR-91770
  • AFM probe
  • Nano manufacturing

Cite this