Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips

Rolf Vermeer; Erwin Berenschot; Edin Sarajlic; Niels Tas; Henri Jansen

doi:10.1109/NANO.2014.6967957

Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips

Rolf Vermeer
, Erwin Berenschot
, Edin Sarajlic
, Niels Tas
, Henri Jansen

Mesoscale Chemical Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

6 Citations (Scopus)

19 Downloads (Pure)

Abstract

In this paper we present the wafer-scale fabrication of molded AFM probes with high aspect ratio ultra-sharp three-plane silicon nitride tips. Using $\langle$111$\rangle$ silicon wafers a dedicated process is developed to fabricate molds in the silicon wafer that have a flat triangular bottom surface enclosed by three \{111\} side planes. By conformally coating the mold with a sufficient thick layer, the mold is sharpened, removing the flat bottom surface in the silicon mold, leaving a mold ending in three \{111\} side planes, which always intersect in a point. This ultimately results in AFM probes with tetrahedral tips consisting of three planes, thus the tips have ultra sharp apexes. We used silicon nitride to mold the probes in order to obtain more wear resistant probes compared with commonly used silicon. Inspection of the fabricated tips shows a tip radius of less than 4 nm.

Original language	English
Title of host publication	Proceedings of the 14th IEEE International Conference on Nanotechnology
Publisher	IEEE
Pages	229-233
Number of pages	5
ISBN (Electronic)	978-1-4799-5622-7
ISBN (Print)	978-1-4799-4082-0
DOIs	https://doi.org/10.1109/NANO.2014.6967957
Publication status	Published - Aug 2014
Event	14th IEEE International Conference on Nanotechnology, NANO 2014 - Toronto, Canada Duration: 18 Aug 2014 → 21 Aug 2014 Conference number: 14

Conference

Conference	14th IEEE International Conference on Nanotechnology, NANO 2014
Abbreviated title	NANO
Country/Territory	Canada
City	Toronto
Period	18/08/14 → 21/08/14

Keywords

2020 OA procedure
TST-FABRICATION
Nanocharacterization
AFM probe
Nano manufacturing

Access to Document

10.1109/NANO.2014.6967957

ArticleFinal published version, 2.15 MBLicence: Taverne

Cite this

@inproceedings{952647a46ad44d2db6cbb6ce577dde24,

title = "Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips",

abstract = "In this paper we present the wafer-scale fabrication of molded AFM probes with high aspect ratio ultra-sharp three-plane silicon nitride tips. Using \$\textbackslash{}langle\$111\$\textbackslash{}rangle\$ silicon wafers a dedicated process is developed to fabricate molds in the silicon wafer that have a flat triangular bottom surface enclosed by three \textbackslash{}\{111\textbackslash{}\} side planes. By conformally coating the mold with a sufficient thick layer, the mold is sharpened, removing the flat bottom surface in the silicon mold, leaving a mold ending in three \textbackslash{}\{111\textbackslash{}\} side planes, which always intersect in a point. This ultimately results in AFM probes with tetrahedral tips consisting of three planes, thus the tips have ultra sharp apexes. We used silicon nitride to mold the probes in order to obtain more wear resistant probes compared with commonly used silicon. Inspection of the fabricated tips shows a tip radius of less than 4 nm.",

keywords = "2020 OA procedure, TST-FABRICATION, Nanocharacterization, AFM probe, Nano manufacturing",

author = "Rolf Vermeer and Erwin Berenschot and Edin Sarajlic and Niels Tas and Henri Jansen",

year = "2014",

month = aug,

doi = "10.1109/NANO.2014.6967957",

language = "English",

isbn = "978-1-4799-4082-0",

pages = "229--233",

booktitle = "Proceedings of the 14th IEEE International Conference on Nanotechnology",

publisher = "IEEE",

address = "United States",

note = "14th IEEE International Conference on Nanotechnology, NANO 2014, NANO ; Conference date: 18-08-2014 Through 21-08-2014",

}

Vermeer, R, Berenschot, E, Sarajlic, E, Tas, N & Jansen, H 2014, Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips. in Proceedings of the 14th IEEE International Conference on Nanotechnology. IEEE, pp. 229-233, 14th IEEE International Conference on Nanotechnology, NANO 2014, Toronto, Ontario, Canada, 18/08/14. https://doi.org/10.1109/NANO.2014.6967957

Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips. / Vermeer, Rolf; Berenschot, Erwin; Sarajlic, Edin et al.
Proceedings of the 14th IEEE International Conference on Nanotechnology. IEEE, 2014. p. 229-233.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips

AU - Vermeer, Rolf

AU - Berenschot, Erwin

AU - Sarajlic, Edin

AU - Tas, Niels

AU - Jansen, Henri

N1 - Conference code: 14

PY - 2014/8

Y1 - 2014/8

N2 - In this paper we present the wafer-scale fabrication of molded AFM probes with high aspect ratio ultra-sharp three-plane silicon nitride tips. Using $\langle$111$\rangle$ silicon wafers a dedicated process is developed to fabricate molds in the silicon wafer that have a flat triangular bottom surface enclosed by three \{111\} side planes. By conformally coating the mold with a sufficient thick layer, the mold is sharpened, removing the flat bottom surface in the silicon mold, leaving a mold ending in three \{111\} side planes, which always intersect in a point. This ultimately results in AFM probes with tetrahedral tips consisting of three planes, thus the tips have ultra sharp apexes. We used silicon nitride to mold the probes in order to obtain more wear resistant probes compared with commonly used silicon. Inspection of the fabricated tips shows a tip radius of less than 4 nm.

AB - In this paper we present the wafer-scale fabrication of molded AFM probes with high aspect ratio ultra-sharp three-plane silicon nitride tips. Using $\langle$111$\rangle$ silicon wafers a dedicated process is developed to fabricate molds in the silicon wafer that have a flat triangular bottom surface enclosed by three \{111\} side planes. By conformally coating the mold with a sufficient thick layer, the mold is sharpened, removing the flat bottom surface in the silicon mold, leaving a mold ending in three \{111\} side planes, which always intersect in a point. This ultimately results in AFM probes with tetrahedral tips consisting of three planes, thus the tips have ultra sharp apexes. We used silicon nitride to mold the probes in order to obtain more wear resistant probes compared with commonly used silicon. Inspection of the fabricated tips shows a tip radius of less than 4 nm.

KW - 2020 OA procedure

KW - TST-FABRICATION

KW - Nanocharacterization

KW - AFM probe

KW - Nano manufacturing

U2 - 10.1109/NANO.2014.6967957

DO - 10.1109/NANO.2014.6967957

M3 - Conference contribution

SN - 978-1-4799-4082-0

SP - 229

EP - 233

BT - Proceedings of the 14th IEEE International Conference on Nanotechnology

PB - IEEE

T2 - 14th IEEE International Conference on Nanotechnology, NANO 2014

Y2 - 18 August 2014 through 21 August 2014

ER -

Fabrication of novel AFM probe with high-aspect-ratio ultra-sharp three-face silicon nitride tips

Abstract

Conference

Keywords

Access to Document

Fingerprint

Cite this