Abstract
Microchannels were created by fusion bonding of a
Pyrex and a thermally oxidized silicon wafer. The
maximum pressure which can be applied to these
channels was investigated. In order to find the relation
between this maximum pressure, channel geometry,
materials elasticity and bond energy an energy model
was developed. It was shown that the model is
substantiated by the pressure data, from which it could
be calculated that the effective bond energy increased
from 0.018 J/m2 to 0.19 J/m2 for an annealing
temperature ranging from 3 10°C to 47OoC.
Original language | Undefined |
---|---|
Title of host publication | Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on |
Place of Publication | Piscataway |
Publisher | IEEE |
Pages | 199-204 |
Number of pages | 6 |
ISBN (Print) | 0-7803-5273-4 |
DOIs | |
Publication status | Published - 23 Jan 2000 |
Event | 13th Annual International Conference on Micro Electro Mechanical Systems, MEMS 2000 - Miyazaki, Japan Duration: 23 Jan 2000 → 27 Jan 2000 Conference number: 13 |
Conference
Conference | 13th Annual International Conference on Micro Electro Mechanical Systems, MEMS 2000 |
---|---|
Abbreviated title | MEMS |
Country/Territory | Japan |
City | Miyazaki |
Period | 23/01/00 → 27/01/00 |
Keywords
- METIS-113060
- EWI-12895
- IR-16175