Failure mechanisms of pressurized microchannels, model and experiments

M.T. Blom, Niels Roelof Tas, G. Pandraud, E. Chmela, Johannes G.E. Gardeniers, Michael Curt Elwenspoek, Albert van den Berg, R.P Tijssen

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Abstract

Microchannels were created by fusion bonding of a Pyrex and a thermally oxidized silicon wafer. The maximum pressure which can be applied to these channels was investigated. In order to find the relation between this maximum pressure, channel geometry, materials elasticity and bond energy an energy model was developed. It was shown that the model is substantiated by the pressure data, from which it could be calculated that the effective bond energy increased from 0.018 J/m2 to 0.19 J/m2 for an annealing temperature ranging from 3 10°C to 47OoC.
Original languageUndefined
Title of host publicationMicro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Place of PublicationPiscataway
PublisherIEEE Computer Society
Pages199-204
Number of pages6
ISBN (Print)0-7803-5273-4
DOIs
Publication statusPublished - 23 Jan 2000
Event13th Annual International Conference on Micro Electro Mechanical Systems, MEMS 2000 - Miyazaki, Japan
Duration: 23 Jan 200027 Jan 2000
Conference number: 13

Conference

Conference13th Annual International Conference on Micro Electro Mechanical Systems, MEMS 2000
Abbreviated titleMEMS
CountryJapan
CityMiyazaki
Period23/01/0027/01/00

Keywords

  • METIS-113060
  • EWI-12895
  • IR-16175

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