Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

Fengze Hou, Wenbo Wang, Rui Ma, Yonghao Li, Zhonglin Han, Meiying Su, Jun Li, Zhongyao Yu, Yang Song, Qidong Wang, Min Chen, Liqiang Cao, Guoqi Zhang, Braham Ferreira

Research output: Contribution to journalArticleAcademicpeer-review

1 Citation (Scopus)

Abstract

In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermomechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100 kHz. Compared with wire-bonded packages, the parasitic inductances of the PCB-embedded package decreased at least by 87.6%. Compared with blind via structure, the thermal resistance of the proposed blind block structure reduced at most by about 26%, and the stress of the SiC MOSFETs decreased by about 45.2%. Then, a novel PCB-embedded packaging process was developed, and three key packaging processes were analyzed. Furthermore, effect of PCB-embedded package on static characterization of SiC MOSFET was analyzed, and it was found that: 1) Output current of PCB-embedded package was decreased under a certain gate-source voltage compared to SiC die; 2) Miller capacitance of SiC MOSFET was increased thanks to parasitic capacitance induced by package; and 3) compared with SiC die, nonflat miller plateau of the PCB-embedded package extends, and as drain-source voltage increases, the nonflat miller plateau extends. Lastly, switching characteristics of the PCB-embedded package and TO-247 package were compared. The results show that the PCB-embedded package has smaller parasitic inductances.
Original languageEnglish
Article number19376549
Pages (from-to)367-380
Number of pages14
JournalIEEE Journal of Emerging and Selected Topics in Power Electronics
Volume8
Issue number1
DOIs
Publication statusPublished - 1 Mar 2020

Keywords

  • Electro-thermo-mechanical codesign
  • Printed Circuit Board (PCB)
  • PCB-embedded package
  • Phase-leg silicon carbide (SiC)
  • Metal-oxide-semiconductor field-effect transistor
  • MOSFET

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