Fast temperature cycling and electromigration induced thin film cracking multilevel interconnection: experiments and modelling

Van Hieu Nguyen, Cora Salm, J. Vroemen, J. Voets, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings ESREF 2002
    Number of pages6
    Publication statusPublished - 2002
    EventESREF 2002: Proceedings ESREF 2002 -
    Duration: 1 Jan 1900 → …


    ConferenceESREF 2002
    Period1/01/00 → …


    • METIS-207776

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