Fast temperature cycling and electromigration induced thin film cracking multilevel interconnection: experiments and modelling

Van Hieu Nguyen, Cora Salm, J. Vroemen, J. Voets, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Contribution to journalArticleAcademicpeer-review

    Original languageUndefined
    Pages (from-to)1415-1420
    Number of pages6
    JournalMicroelectronics reliability
    Publication statusPublished - 2002


    • METIS-207806

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