Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection

Van Hieu Nguyen, H. Nguyen Van, Cora Salm, J. Vroemen, J. Voets, B.H. Krabbenborg, J.J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002
    Place of PublicationUtrecht, The Netherlands
    PublisherSTW
    Pages69-74
    Number of pages6
    ISBN (Print)90-73461-33-2
    Publication statusPublished - 27 Nov 2002
    Event5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002 - Veldhoven, Netherlands
    Duration: 27 Nov 200228 Nov 2002
    Conference number: 5

    Workshop

    Workshop5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002
    Abbreviated titleSAFE
    CountryNetherlands
    CityVeldhoven
    Period27/11/0228/11/02

    Keywords

    • METIS-207333

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