Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection

Van Hieu Nguyen, H. Nguyen Van, Cora Salm, J. Vroemen, J. Voets, B.H. Krabbenborg, J.J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002
    Place of PublicationUtrecht, The Netherlands
    PublisherSTW
    Pages69-74
    Number of pages6
    ISBN (Print)90-73461-33-2
    Publication statusPublished - 27 Nov 2002
    Event5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002 - Veldhoven, Netherlands
    Duration: 27 Nov 200228 Nov 2002
    Conference number: 5

    Workshop

    Workshop5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002
    Abbreviated titleSAFE
    CountryNetherlands
    CityVeldhoven
    Period27/11/0228/11/02

    Keywords

    • METIS-207333

    Cite this

    Nguyen, V. H., Nguyen Van, H., Salm, C., Vroemen, J., Voets, J., Krabbenborg, B. H., ... Kuper, F. G. (2002). Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection. In Proceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002 (pp. 69-74). Utrecht, The Netherlands: STW.
    Nguyen, Van Hieu ; Nguyen Van, H. ; Salm, Cora ; Vroemen, J. ; Voets, J. ; Krabbenborg, B.H. ; Bisschop, J.J. ; Mouthaan, A.J. ; Kuper, F.G. / Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection. Proceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002. Utrecht, The Netherlands : STW, 2002. pp. 69-74
    @inproceedings{7835c64657374ac7a24fa9057169cc05,
    title = "Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection",
    keywords = "METIS-207333",
    author = "Nguyen, {Van Hieu} and {Nguyen Van}, H. and Cora Salm and J. Vroemen and J. Voets and B.H. Krabbenborg and J.J. Bisschop and A.J. Mouthaan and F.G. Kuper",
    year = "2002",
    month = "11",
    day = "27",
    language = "Undefined",
    isbn = "90-73461-33-2",
    pages = "69--74",
    booktitle = "Proceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002",
    publisher = "STW",

    }

    Nguyen, VH, Nguyen Van, H, Salm, C, Vroemen, J, Voets, J, Krabbenborg, BH, Bisschop, JJ, Mouthaan, AJ & Kuper, FG 2002, Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection. in Proceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002. STW, Utrecht, The Netherlands, pp. 69-74, 5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002, Veldhoven, Netherlands, 27/11/02.

    Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection. / Nguyen, Van Hieu; Nguyen Van, H.; Salm, Cora; Vroemen, J.; Voets, J.; Krabbenborg, B.H.; Bisschop, J.J.; Mouthaan, A.J.; Kuper, F.G.

    Proceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002. Utrecht, The Netherlands : STW, 2002. p. 69-74.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    TY - GEN

    T1 - Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection

    AU - Nguyen, Van Hieu

    AU - Nguyen Van, H.

    AU - Salm, Cora

    AU - Vroemen, J.

    AU - Voets, J.

    AU - Krabbenborg, B.H.

    AU - Bisschop, J.J.

    AU - Mouthaan, A.J.

    AU - Kuper, F.G.

    PY - 2002/11/27

    Y1 - 2002/11/27

    KW - METIS-207333

    M3 - Conference contribution

    SN - 90-73461-33-2

    SP - 69

    EP - 74

    BT - Proceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002

    PB - STW

    CY - Utrecht, The Netherlands

    ER -

    Nguyen VH, Nguyen Van H, Salm C, Vroemen J, Voets J, Krabbenborg BH et al. Fast Temperature Cycling Stress-Induced and Electromigration-Induced Interlayer Dielectric Cracking Failure in Multilevel Interconnection. In Proceedings of 5th Annual Workshop on Semiconductors Advances for Future Electronics SAFE 2002. Utrecht, The Netherlands: STW. 2002. p. 69-74