Fast temperature cycling stress-induced and electromigration-induced interlayer dielectric cracking failure in multilevel interconnection

Van Hieu Nguyen, H. Nguyen, Cora Salm, J. Vroemen, J. Voets, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Contribution to conferencePaper

    Abstract

    There is an increasing reliability concern of thermal stress-induced and electromigration-induced failures in multilevel interconnections in recent years. This paper reports our investigations of thin film cracking of a multilevel interconnect due to fast temperature cycling and electromigration stresses. The fast temperature cycling tests have been performed in three temperature cycle ranges. The failure times are represented well by a Weibull distribution. The distributions are relatively well behaved with generally similar slope (shape factor). The failure mechanism is well fitted by the Coffin-Manson equation indicating a uniform acceleration. The observation of cracking in the interlayer dielectric due to fast temperature cycling stress from failure analysis agrees well with the failure mechanism modeling and the calculated Coffin- Manson exponent. Electromigration experiments have shown that devices failed due to extrusion-shorts without increasing of resistance of metal line. The failure times are represented better by the Weibull distribution than by the lognormal distribution (normally used for electromigration data). A simulation of stress build-up in metal line using an electromigration simulator confirmed that the cracking of interlayer dielectric is the weakest spot and most likely to cause electromigration failure.
    Original languageUndefined
    Pages69-74
    Number of pages6
    Publication statusPublished - 27 Nov 2002
    Event5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002 - Veldhoven, Netherlands
    Duration: 27 Nov 200228 Nov 2002
    Conference number: 5

    Workshop

    Workshop5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002
    Abbreviated titleSAFE
    CountryNetherlands
    CityVeldhoven
    Period27/11/0228/11/02

    Keywords

    • EWI-15597
    • Cracking
    • ILD
    • Thermal cycling
    • IR-67505

    Cite this

    Nguyen, V. H., Nguyen, H., Salm, C., Vroemen, J., Voets, J., Krabbenborg, B. H., ... Kuper, F. G. (2002). Fast temperature cycling stress-induced and electromigration-induced interlayer dielectric cracking failure in multilevel interconnection. 69-74. Paper presented at 5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002, Veldhoven, Netherlands.