Fast temperature cycling stress-induced and electromigration-induced interlayer dielectric cracking failure in multilevel interconnection

Van Hieu Nguyen, H. Nguyen, Cora Salm, J. Vroemen, J. Voets, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Contribution to conferencePaper


    There is an increasing reliability concern of thermal stress-induced and electromigration-induced failures in multilevel interconnections in recent years. This paper reports our investigations of thin film cracking of a multilevel interconnect due to fast temperature cycling and electromigration stresses. The fast temperature cycling tests have been performed in three temperature cycle ranges. The failure times are represented well by a Weibull distribution. The distributions are relatively well behaved with generally similar slope (shape factor). The failure mechanism is well fitted by the Coffin-Manson equation indicating a uniform acceleration. The observation of cracking in the interlayer dielectric due to fast temperature cycling stress from failure analysis agrees well with the failure mechanism modeling and the calculated Coffin- Manson exponent. Electromigration experiments have shown that devices failed due to extrusion-shorts without increasing of resistance of metal line. The failure times are represented better by the Weibull distribution than by the lognormal distribution (normally used for electromigration data). A simulation of stress build-up in metal line using an electromigration simulator confirmed that the cracking of interlayer dielectric is the weakest spot and most likely to cause electromigration failure.
    Original languageUndefined
    Number of pages6
    Publication statusPublished - 27 Nov 2002
    Event5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002 - Veldhoven, Netherlands
    Duration: 27 Nov 200228 Nov 2002
    Conference number: 5


    Workshop5th Annual Workshop on Semiconductors Advances for Future Electronics, SAFE 2002
    Abbreviated titleSAFE


    • EWI-15597
    • Cracking
    • ILD
    • Thermal cycling
    • IR-67505

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