Fast Thermal Cycling Stress and Degredations in Multilayer Interconnects

Van Hieu Nguyen; Cora Salm; J. Vroemen; B.H. Krabbenborg; J. Bisschop; A.J. Mouthaan; F.G. Kuper

Fast Thermal Cycling Stress and Degredations in Multilayer Interconnects

Van Hieu Nguyen, Cora Salm, J. Vroemen, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	Undefined
Title of host publication	Proceedings of SAFE - ProRISC - SeSens 2001, November 28-30, 2001, Veldhoven, the Netherlands
Place of Publication	Utrecht
Publisher	STW
Pages	136-140
Number of pages	5
ISBN (Print)	90-73461-29-4
Publication status	Published - 28 Nov 2001
Event	4th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2001 - Veldhoven, Netherlands Duration: 28 Nov 2001 → 30 Nov 2001

Workshop

Workshop	4th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2001
Country/Territory	Netherlands
City	Veldhoven
Period	28/11/01 → 30/11/01

Cite this

@inproceedings{6b1a80dffdef4df98367482746495464,

title = "Fast Thermal Cycling Stress and Degredations in Multilayer Interconnects",

author = "Nguyen, \{Van Hieu\} and Cora Salm and J. Vroemen and B.H. Krabbenborg and J. Bisschop and A.J. Mouthaan and F.G. Kuper",

year = "2001",

month = nov,

day = "28",

language = "Undefined",

isbn = "90-73461-29-4",

pages = "136--140",

booktitle = "Proceedings of SAFE - ProRISC - SeSens 2001, November 28-30, 2001, Veldhoven, the Netherlands",

publisher = "STW",

note = "4th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2001 ; Conference date: 28-11-2001 Through 30-11-2001",

}

Nguyen, VH, Salm, C, Vroemen, J, Krabbenborg, BH, Bisschop, J, Mouthaan, AJ & Kuper, FG 2001, Fast Thermal Cycling Stress and Degredations in Multilayer Interconnects. in Proceedings of SAFE - ProRISC - SeSens 2001, November 28-30, 2001, Veldhoven, the Netherlands. STW, Utrecht, pp. 136-140, 4th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2001, Veldhoven, Netherlands, 28/11/01.

TY - GEN

T1 - Fast Thermal Cycling Stress and Degredations in Multilayer Interconnects

AU - Nguyen, Van Hieu

AU - Salm, Cora

AU - Vroemen, J.

AU - Krabbenborg, B.H.

AU - Bisschop, J.

AU - Mouthaan, A.J.

AU - Kuper, F.G.

PY - 2001/11/28

Y1 - 2001/11/28

M3 - Conference contribution

SN - 90-73461-29-4

SP - 136

EP - 140

BT - Proceedings of SAFE - ProRISC - SeSens 2001, November 28-30, 2001, Veldhoven, the Netherlands

PB - STW

CY - Utrecht

T2 - 4th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2001

Y2 - 28 November 2001 through 30 November 2001

ER -