Flash release - an alternative for releasing complex MEMS devices

S. Deladi, G.J.M. Krijnen, M.C. Elwenspoek, V. Svetovoy

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    10 Citations (Scopus)

    Abstract

    A novel time-saving and cost-effective release technique has been developed and is described. The physical nature of the process is explained in combination with experimental observations. The results of the flash release process are compared with those of freeze-drying and supercritical CO2 releasing. It is demonstrated that the new technique is not only simpler but it also gives better yield for long cantilevers. Furthermore, it is shown that the process can be used successfully for complex MEMS devices that consist of multiple-structural layers, but which do not contain membrane-like structures.
    Original languageEnglish
    Title of host publicationDesign, Test, Integration and Packaging of MEMS/MOEMS 2004
    Subtitle of host publication12-14 May 2004, Cannes, France
    EditorsBernard Courtois, Masayoshi Esashi, Adrian Ionescu, Jean Michel Karam, Jan Korvink, Karen Markus
    Place of PublicationGrenoble
    PublisherTIMA Laboratory
    Pages343-348
    ISBN (Print)2-84813-026-1
    Publication statusPublished - 2004
    Event2004 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2004 - Cannes, France
    Duration: 12 May 200414 May 2004

    Conference

    Conference2004 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2004
    Abbreviated titleDTIP
    CountryFrance
    CityCannes
    Period12/05/0414/05/04

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