Flip-chip assembly for photonic Circuits

Kerstin Worhoff, Rene Heideman, M.J. Gilde, K. Blidegn, M. Heschel, H.H. van den Vlekkert

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    2 Citations (Scopus)
    Original languageUndefined
    Title of host publicationProceedings SPIE Photonics Europe - Micro-optics: Fabrication, Packaging and Integration
    Place of PublicationStrasbourg, France
    PublisherSPIE
    Pages09-20
    Number of pages12
    ISBN (Print)0-8194-5377-3
    Publication statusPublished - 27 Apr 2004
    EventSPIE Photonics Europe 2004 - Strasbourg, France
    Duration: 27 Apr 200429 Apr 2004

    Publication series

    Name
    Volume5454

    Conference

    ConferenceSPIE Photonics Europe 2004
    CountryFrance
    CityStrasbourg
    Period27/04/0429/04/04

    Keywords

    • METIS-220638

    Cite this

    Worhoff, K., Heideman, R., Gilde, M. J., Blidegn, K., Heschel, M., & van den Vlekkert, H. H. (2004). Flip-chip assembly for photonic Circuits. In Proceedings SPIE Photonics Europe - Micro-optics: Fabrication, Packaging and Integration (pp. 09-20). Strasbourg, France: SPIE.