Flip-chip assembly for photonic Circuits

Kerstin Worhoff; Rene Heideman; M.J. Gilde; K. Blidegn; M. Heschel; H.H. van den Vlekkert

Flip-chip assembly for photonic Circuits

Kerstin Worhoff
, Rene Heideman
, M.J. Gilde
, K. Blidegn
, M. Heschel
, H.H. van den Vlekkert

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	Undefined
Title of host publication	Proceedings SPIE Photonics Europe - Micro-optics: Fabrication, Packaging and Integration
Place of Publication	Strasbourg, France
Publisher	SPIE
Pages	09-20
Number of pages	12
ISBN (Print)	0-8194-5377-3
Publication status	Published - 27 Apr 2004
Event	SPIE Photonics Europe 2004 - Strasbourg, France Duration: 27 Apr 2004 → 29 Apr 2004

Publication series

Name
Volume	5454

Conference

Conference	SPIE Photonics Europe 2004
Country/Territory	France
City	Strasbourg
Period	27/04/04 → 29/04/04

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

METIS-220638

Cite this

@inproceedings{ee68934bf4014a50913a40d6b131278c,

title = "Flip-chip assembly for photonic Circuits",

keywords = "METIS-220638",

author = "Kerstin Worhoff and Rene Heideman and M.J. Gilde and K. Blidegn and M. Heschel and \{van den Vlekkert\}, H.H.",

year = "2004",

month = apr,

day = "27",

language = "Undefined",

isbn = "0-8194-5377-3",

publisher = "SPIE",

pages = "09--20",

booktitle = "Proceedings SPIE Photonics Europe - Micro-optics: Fabrication, Packaging and Integration",

address = "United States",

note = "SPIE Photonics Europe 2004 ; Conference date: 27-04-2004 Through 29-04-2004",

}

TY - GEN

T1 - Flip-chip assembly for photonic Circuits

AU - Worhoff, Kerstin

AU - Heideman, Rene

AU - Gilde, M.J.

AU - Blidegn, K.

AU - Heschel, M.

AU - van den Vlekkert, H.H.

PY - 2004/4/27

Y1 - 2004/4/27

KW - METIS-220638

M3 - Conference contribution

SN - 0-8194-5377-3

SP - 9

EP - 20

BT - Proceedings SPIE Photonics Europe - Micro-optics: Fabrication, Packaging and Integration

PB - SPIE

CY - Strasbourg, France

T2 - SPIE Photonics Europe 2004

Y2 - 27 April 2004 through 29 April 2004

ER -