Flip-chip assembly of an integrated optical sensor

K. Worhoff; R.G. Heideman; M.J. Gilde; K. Blidegn; M. Heschel; H.H. van den Vlekkert

Flip-chip assembly of an integrated optical sensor

K. Worhoff, R.G. Heideman, M.J. Gilde, K. Blidegn, M. Heschel, H.H. van den Vlekkert

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

For enabling low cost mass production for photonic circuits, the application of flipchip technology creates huge expectations. We report on the results of a project, having the goal to demonstrate standard packaging technology in combination with integrated optics, entailing demands and limitations different from IC technology. Mainly fiber attachment, but also special features as sensor window accessibility at the top-side of the chip are prohibiting the positioning of the optical layer stack and solder pads at the same side of the silicon wafer. Therefore, feed through technology had to be included. Compatibility issues in combining feed through technology with integrated optics processing have been solved and the feasibility of feed-through metallization and flip-chip assembly in combination with an integrated optical sensor has been demonstrated.

Original language	English
Title of host publication	Proceedings 2004 Ninth Annual Symposium of the IEEE/LEOS Benelux Chapter
Place of Publication	Ghent, Belgium
Publisher	Ghent University
Pages	25-28
Number of pages	4
ISBN (Print)	9076546061
Publication status	Published - 2 Dec 2004
Event	9th Annual Symposium IEEE/LEOS Benelux Chapter 2004 - Ghent, Belgium Duration: 2 Dec 2004 → 3 Dec 2004 Conference number: 9

Conference

Conference	9th Annual Symposium IEEE/LEOS Benelux Chapter 2004
Country/Territory	Belgium
City	Ghent
Period	2/12/04 → 3/12/04

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title = "Flip-chip assembly of an integrated optical sensor",

abstract = "For enabling low cost mass production for photonic circuits, the application of flipchip technology creates huge expectations. We report on the results of a project, having the goal to demonstrate standard packaging technology in combination with integrated optics, entailing demands and limitations different from IC technology. Mainly fiber attachment, but also special features as sensor window accessibility at the top-side of the chip are prohibiting the positioning of the optical layer stack and solder pads at the same side of the silicon wafer. Therefore, feed through technology had to be included. Compatibility issues in combining feed through technology with integrated optics processing have been solved and the feasibility of feed-through metallization and flip-chip assembly in combination with an integrated optical sensor has been demonstrated.",

author = "K. Worhoff and R.G. Heideman and M.J. Gilde and K. Blidegn and M. Heschel and {van den Vlekkert}, H.H.",

year = "2004",

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language = "English",

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pages = "25--28",

booktitle = "Proceedings 2004 Ninth Annual Symposium of the IEEE/LEOS Benelux Chapter",

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note = "9th Annual Symposium IEEE/LEOS Benelux Chapter 2004 ; Conference date: 02-12-2004 Through 03-12-2004",

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T1 - Flip-chip assembly of an integrated optical sensor

AU - Worhoff, K.

AU - Heideman, R.G.

AU - Gilde, M.J.

AU - Blidegn, K.

AU - Heschel, M.

AU - van den Vlekkert, H.H.

N1 - Conference code: 9

PY - 2004/12/2

Y1 - 2004/12/2

N2 - For enabling low cost mass production for photonic circuits, the application of flipchip technology creates huge expectations. We report on the results of a project, having the goal to demonstrate standard packaging technology in combination with integrated optics, entailing demands and limitations different from IC technology. Mainly fiber attachment, but also special features as sensor window accessibility at the top-side of the chip are prohibiting the positioning of the optical layer stack and solder pads at the same side of the silicon wafer. Therefore, feed through technology had to be included. Compatibility issues in combining feed through technology with integrated optics processing have been solved and the feasibility of feed-through metallization and flip-chip assembly in combination with an integrated optical sensor has been demonstrated.

AB - For enabling low cost mass production for photonic circuits, the application of flipchip technology creates huge expectations. We report on the results of a project, having the goal to demonstrate standard packaging technology in combination with integrated optics, entailing demands and limitations different from IC technology. Mainly fiber attachment, but also special features as sensor window accessibility at the top-side of the chip are prohibiting the positioning of the optical layer stack and solder pads at the same side of the silicon wafer. Therefore, feed through technology had to be included. Compatibility issues in combining feed through technology with integrated optics processing have been solved and the feasibility of feed-through metallization and flip-chip assembly in combination with an integrated optical sensor has been demonstrated.

M3 - Conference contribution

SN - 9076546061

SP - 25

EP - 28

BT - Proceedings 2004 Ninth Annual Symposium of the IEEE/LEOS Benelux Chapter

PB - Ghent University

CY - Ghent, Belgium

T2 - 9th Annual Symposium IEEE/LEOS Benelux Chapter 2004

Y2 - 2 December 2004 through 3 December 2004

ER -

Flip-chip assembly of an integrated optical sensor

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