For enabling low cost mass production for photonic circuits, the application of flipchip technology creates huge expectations. We report on the results of a project, having the goal to demonstrate standard packaging technology in combination with integrated optics, entailing demands and limitations different from IC technology. Mainly fiber attachment, but also special features as sensor window accessibility at the top-side of the chip are prohibiting the positioning of the optical layer stack and solder pads at the same side of the silicon wafer. Therefore, feed through technology had to be included. Compatibility issues in combining feed through technology with integrated optics processing have been solved and the feasibility of feed-through metallization and flip-chip assembly in combination with an integrated optical sensor has been demonstrated.
|Title of host publication||Proceedings 2004 Ninth Annual Symposium of the IEEE/LEOS Benelux Chapter|
|Place of Publication||Ghent, Belgium|
|Number of pages||4|
|Publication status||Published - 2 Dec 2004|
|Event||9th Annual Symposium IEEE/LEOS Benelux Chapter 2004 - Ghent, Belgium|
Duration: 2 Dec 2004 → 3 Dec 2004
Conference number: 9
|Conference||9th Annual Symposium IEEE/LEOS Benelux Chapter 2004|
|Period||2/12/04 → 3/12/04|
Worhoff, K., Heideman, R. G., Gilde, M. J., Blidegn, K., Heschel, M., & van den Vlekkert, H. H. (2004). Flip-chip assembly of an integrated optical sensor. In Proceedings 2004 Ninth Annual Symposium of the IEEE/LEOS Benelux Chapter (pp. 25-28). Ghent, Belgium: Ghent University.