TY - JOUR
T1 - Fluidic and Mechanical Thermal Control Devices
AU - Klinar, Katja
AU - Swoboda, Timm
AU - Rojo, Miguel Muñoz
AU - Kitanovski, Andrej
N1 - Funding Information:
The authors acknowledge the financial support of the Slovenian Research Agency for the projects Electrocaloric devices for active cooling of electronic circuits J2-1738 and Multicaloric Cooling J2-9253 and the research core funding No. P2-0223. The authors acknowledge the financial support of the Rectorates University of Twente (UT) & University of M?nster (WWU) for the Decision Strategic Collaboration Grants ? University of Twente and University of M?nster 2019?2020, (reference number: CvB UIT-4395).
Funding Information:
The authors acknowledge the financial support of the Rectorates University of Twente (UT) & University of Münster (WWU) for the Decision Strategic Collaboration Grants – University of Twente and University of Münster 2019–2020, (reference number: CvB UIT‐4395).
Funding Information:
The authors acknowledge the financial support of the Slovenian Research Agency for the projects Electrocaloric devices for active cooling of electronic circuits J2‐1738 and Multicaloric Cooling J2‐9253 and the research core funding No. P2‐0223.
Publisher Copyright:
© 2020 The Authors. Advanced Electronic Materials published by Wiley-VCH GmbH
PY - 2021/3
Y1 - 2021/3
N2 - In recent years, intensive studies on thermal control devices have been conducted for the thermal management of electronics and computers as well as for applications in energy conversion, chemistry, sensors, buildings, and outer space. Conventional cooling or heating techniques realized using traditional thermal resistors and capacitors cannot meet the thermal requirements of advanced systems. Therefore, new thermal control devices are being investigated to satisfy these requirements. These devices include thermal diodes, thermal switches, thermal regulators, and thermal transistors, all of which manage heat in a manner analogous to how electronic devices and circuits control electricity. To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state‐of‐the‐art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges. Operation principles, working parameters, and limitations are discussed and the most important features for a particular device are identified.
AB - In recent years, intensive studies on thermal control devices have been conducted for the thermal management of electronics and computers as well as for applications in energy conversion, chemistry, sensors, buildings, and outer space. Conventional cooling or heating techniques realized using traditional thermal resistors and capacitors cannot meet the thermal requirements of advanced systems. Therefore, new thermal control devices are being investigated to satisfy these requirements. These devices include thermal diodes, thermal switches, thermal regulators, and thermal transistors, all of which manage heat in a manner analogous to how electronic devices and circuits control electricity. To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state‐of‐the‐art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges. Operation principles, working parameters, and limitations are discussed and the most important features for a particular device are identified.
U2 - 10.1002/aelm.202000623
DO - 10.1002/aelm.202000623
M3 - Review article
SN - 2199-160X
VL - 7
JO - Advanced electronic materials
JF - Advanced electronic materials
IS - 3
M1 - 2000623
ER -