TY - JOUR
T1 - Formation of metal nano- and micro-patterns on self-assembled monolayers using pulsed laser deposition through nanostencils and electroless deposition
AU - Speets, E.A.
AU - te Riele, P.M.
AU - van den Boogaart, M.A.F.
AU - Doeswijk, L.M.
AU - Ravoo, B.J.
AU - Rijnders, G.
AU - Brugger, J.
AU - Reinhoudt, D.N.
AU - Blank, D.H.A.
PY - 2006
Y1 - 2006
N2 - Patterns of noble-metal structures on top of self-assembled monolayers (SAMs) on Au and SiO2 substrates have been prepared following two approaches. The first approach consists of pulsed laser deposition (PLD) of Pt, Pd, Au, or Cu through nano- and microstencils. In the second approach, noble-metal cluster patterns deposited through nano- and microstencils are used as catalysts for selective electroless deposition (ELD) of Cu. Cu structures are grown on SAMs on both Au and SiO2 substrates and are subsequently analyzed using X-ray photoelectron spectroscopy element mapping, atomic force microscopy, and optical microscopy. The combination of PLD through stencils on SAMs followed by ELD is a new method for the creation of (sub)-micrometer-sized metal structures on top of SAMs. This method minimizes the gas-phase deposition step, which is often responsible for damage to, or electrical shorts through, the SAM.
AB - Patterns of noble-metal structures on top of self-assembled monolayers (SAMs) on Au and SiO2 substrates have been prepared following two approaches. The first approach consists of pulsed laser deposition (PLD) of Pt, Pd, Au, or Cu through nano- and microstencils. In the second approach, noble-metal cluster patterns deposited through nano- and microstencils are used as catalysts for selective electroless deposition (ELD) of Cu. Cu structures are grown on SAMs on both Au and SiO2 substrates and are subsequently analyzed using X-ray photoelectron spectroscopy element mapping, atomic force microscopy, and optical microscopy. The combination of PLD through stencils on SAMs followed by ELD is a new method for the creation of (sub)-micrometer-sized metal structures on top of SAMs. This method minimizes the gas-phase deposition step, which is often responsible for damage to, or electrical shorts through, the SAM.
KW - EC Grant Agreement nr.: FP6/500120
KW - 2024 OA procedure
U2 - 10.1002/adfm.200500933
DO - 10.1002/adfm.200500933
M3 - Article
SN - 1616-301X
VL - 16
SP - 1337
EP - 1743
JO - Advanced functional materials
JF - Advanced functional materials
IS - 10
ER -