Abstract
Test structures for the electrical characterization of ultrathin conductive films are presented based on electrodes on which the ultrathin film is deposited. Two different designs are discussed: a novel design with buried electrodes and a conventional design with electrodes at the surface. This work includes test structure design and fabrication, and the electrical characterization of ALD TiN films down to 4 nm. We demonstrate that the novel test structures provide the same results as the conventional structures, and have the advantage of broader materials choice (i.e. conductor-dielectric combination). The proposed structures can be used successfully to characterize sub 10 nm films.
Original language | Undefined |
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Pages (from-to) | 178-184 |
Number of pages | 7 |
Journal | IEEE transactions on semiconductor manufacturing |
Volume | 25 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2 Jan 2012 |
Keywords
- EWI-21147
- IR-79454
- METIS-284953