Freeform-Optimized Shapes for Natural-Convection Cooling

  • Wessel W. Wits*
  • , Davoud Jafari
  • , Yannick Jeggels
  • , Sjoerd Van De Velde
  • , Daniel Jeggels
  • , Norbert Engelberts
  • *Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    12 Citations (Scopus)
    26 Downloads (Pure)

    Abstract

    This paper presents numerical and experimental results for natural-convection cooling of freeform-optimized shapes. State-of-the-art 3D-printing technologies are utilized to fabricate innovative heat sink designs. Biomimicry was used to develop heat sink shapes based on brain coral. CFD-optimized designs were systematically analysed altering the number and size of air inlet holes to improve airflow circulation. Selectively laser-sintered polyamide heat sinks were used for experimental airflow testing, whereas selectively laser-melted aluminium heat sinks were used for thermal performance testing. Material properties as well as heat sink thermal resistances were determined. A good agreement between numerical and experimental results was found. The validated numerical approach can be used to further enhance freeform heat sink shapes. Moreover, the non-uniform material properties, which 3D-printed parts inherently feature, that were experimentally determined as part of this study can be included into the numerical model and optimization strategies.

    Original languageEnglish
    Title of host publicationTHERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
    PublisherIEEE
    ISBN (Electronic)9781538667590
    DOIs
    Publication statusPublished - 27 Dec 2018
    Event24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 - Scandic Victoria Tower, Stockholm, Sweden
    Duration: 26 Sept 201828 Sept 2018
    Conference number: 24
    https://therminic2018.eu/

    Conference

    Conference24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018
    Abbreviated titleTHERMINIC 2018
    Country/TerritorySweden
    CityStockholm
    Period26/09/1828/09/18
    Internet address

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