Abstract
We present a improvement of our previous design of wireframe tips for scanning Hall probes. By doubling the separation between electrode structures and cantilever base, the yield could be raised from less than 10% to over 75%. To avoid build up of stress gradients, the entire probe
is manufactured from silicon-nitride, using a polysilicon sacrificial layer. In this paper cantilever stress measurement and Initial electrical characterization are presented.
Original language | Undefined |
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Title of host publication | 23rd Micromechanics and Microsystems Europe Workshop, MME 2012 |
Place of Publication | Ilmenau |
Publisher | Ilmenau University of Technology |
Pages | A13 |
Number of pages | 4 |
ISBN (Print) | 978-3-938843-71-0 |
Publication status | Published - Sep 2012 |
Event | 23rd Micromechanics and Microsystems Europe Workshop, MME 2012 - Ilmenau, Germany Duration: 9 Sep 2012 → 12 Sep 2012 Conference number: 23 |
Publication series
Name | |
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Publisher | Ilmenau University of Technology |
Workshop
Workshop | 23rd Micromechanics and Microsystems Europe Workshop, MME 2012 |
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Abbreviated title | MME |
Country | Germany |
City | Ilmenau |
Period | 9/09/12 → 12/09/12 |
Keywords
- EWI-22587
- TST-SMI: Formerly in EWI-SMI
- Corner lithography technique
- Scanning Hall Probe Microscopy
- IR-82308
- METIS-289801