Fusion-bonded fluidic interconnects

I. Fazal, Michael Curt Elwenspoek

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    A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are discussed in terms of the homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 νm thick silicon, with glass tubes having an outer diameter of 6 mm and with a wall thickness of 2 mm, is more than 60 bars after annealing at a temperature of 800 °C.
    Original languageUndefined
    Article number10.1088/0960-1317/18/5/055011
    Pages (from-to)055011
    Number of pages7
    JournalJournal of micromechanics and microengineering
    Issue numberWoTUG-31/5
    Publication statusPublished - 1 May 2008


    • METIS-254927
    • EWI-14256
    • IR-65152

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