Abstract
Low thermal budgets are required to realize 3-D integrated circuits (IC) such as e.g. stacked memory devices. For a better performance of circuit components, an additional improvement of low temperature silicon films is needed. Numerous crystallization techniques can provide polysilicon films with sufficiently large grains [1-3]. However, due to the uncontrollable formation of grain boundaries one can expect a strong variation of the device parameters. Although many techniques are capable of providing a sufficient control over crystal grains and grain boundaries, they require complicated additional process steps such as e.g. air-gap formation [2], seed formation in underlying material for the locationcontrolled grain growth [3], etc. This makes those techniques hardly applicable.
| Original language | English |
|---|---|
| Title of host publication | Thin Film Transistor Technology 8 |
| Editors | Yue Kuo |
| Publisher | Electrochemical Society |
| Pages | 185-191 |
| Number of pages | 7 |
| ISBN (Print) | 1-56677-508-6 |
| DOIs | |
| Publication status | Published - 29 Oct 2006 |
| Event | 8th Symposium on Thin Film Transistor Technologies, TFTT 2006 - Cancun, Mexico Duration: 29 Oct 2006 → 3 Nov 2006 Conference number: 8 |
Publication series
| Name | ECS Transactions 3, 8 (2006) |
|---|---|
| Publisher | ECS |
| Number | 10 |
| Volume | 3 |
| ISSN (Print) | 1938-5862 |
| ISSN (Electronic) | 1938-6737 |
Conference
| Conference | 8th Symposium on Thin Film Transistor Technologies, TFTT 2006 |
|---|---|
| Abbreviated title | TFTT |
| Country/Territory | Mexico |
| City | Cancun |
| Period | 29/10/06 → 3/11/06 |
Keywords
- SC-ICF: Integrated Circuit Fabrication
- IR-61702
- METIS-237704
- EWI-8406