In this study, the molecular dynamics simulation method was employed to investigate the growth of silicon nitride films by using N+ ions, with energies of 50, 100, 150 and 200 eV, to bombard an amorphous silicon surface at 300 K. After an initial period of N+ bombardment, saturation of the number of N atoms deposited on the surface is observed, which is in agreement with experiments. During subsequent steady state deposition, a balance between uptake of N by the surface and sputtering of previously deposited N is established. The Si(Nx) (x = 1–4) and N(Siy) (y = 1–3) bond configurations in the grown films are analyzed.
|Number of pages||4|
|Journal||Nuclear instruments and methods in physics research. Section B : Beam interactions with materials and atoms|
|Publication status||Published - 2009|
Gou, F., Gleeson, M. A., Kleyn, A. W., van de Kruijs, R. W. E., Yakshin, A., & Bijkerk, F. (2009). Growth of silicon nitride films by bombarding amorphous silicon with N+ ions: MD simulation. Nuclear instruments and methods in physics research. Section B : Beam interactions with materials and atoms, 267(18), 3245-3248. https://doi.org/10.1016/j.nimb.2009.06.091