Heat transfer at dielectric-metallic interfaces in the ultra-low temperature range

J. Liberadzka*, J. Golm, T. Koettig, J. Bremer, H. J.M. Ter Brake

*Corresponding author for this work

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Abstract

In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: A sapphire-indium-copper and a sapphire-Titanium-gold-indium-copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric-metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode's design are presented.

Original languageEnglish
Article number012133
JournalIOP Conference Series: Materials Science and Engineering
Volume502
Issue number1
DOIs
Publication statusPublished - 3 Jun 2019
Event27th International Cryogenics Engineering Conference and International Cryogenic Materials Conference 2018 - Oxford, United Kingdom
Duration: 3 Sep 20187 Sep 2018
Conference number: 27

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