Heat transfer at dielectric-metallic interfaces in the ultra-low temperature range

J. Liberadzka; J. Golm; T. Koettig; J. Bremer; H. J.M. Ter Brake

doi:10.1088/1757-899X/502/1/012133

Heat transfer at dielectric-metallic interfaces in the ultra-low temperature range

J. Liberadzka^*, J. Golm, T. Koettig, J. Bremer, H. J.M. Ter Brake

^*Corresponding author for this work

Energy Materials Systems

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Abstract

In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: A sapphire-indium-copper and a sapphire-Titanium-gold-indium-copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric-metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode's design are presented.

Original language	English
Article number	012133
Journal	IOP Conference Series: Materials Science and Engineering
Volume	502
Issue number	1
DOIs	https://doi.org/10.1088/1757-899X/502/1/012133
Publication status	Published - 3 Jun 2019
Event	27th International Cryogenics Engineering Conference and International Cryogenic Materials Conference 2018 - Oxford, United Kingdom Duration: 3 Sept 2018 → 7 Sept 2018 Conference number: 27

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10.1088/1757-899X/502/1/012133Licence: CC BY

Liberadzka_2019_IOP_Conf._Ser.__Mater._Sci._Eng._502_012133Final published version, 2.87 MBLicence: CC BY

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title = "Heat transfer at dielectric-metallic interfaces in the ultra-low temperature range",

abstract = "In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: A sapphire-indium-copper and a sapphire-Titanium-gold-indium-copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric-metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode's design are presented.",

author = "J. Liberadzka and J. Golm and T. Koettig and J. Bremer and {Ter Brake}, {H. J.M.}",

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T1 - Heat transfer at dielectric-metallic interfaces in the ultra-low temperature range

AU - Liberadzka, J.

AU - Golm, J.

AU - Koettig, T.

AU - Bremer, J.

AU - Ter Brake, H. J.M.

N1 - Conference code: 27

PY - 2019/6/3

Y1 - 2019/6/3

N2 - In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: A sapphire-indium-copper and a sapphire-Titanium-gold-indium-copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric-metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode's design are presented.

AB - In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: A sapphire-indium-copper and a sapphire-Titanium-gold-indium-copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric-metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode's design are presented.

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DO - 10.1088/1757-899X/502/1/012133

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AN - SCOPUS:85065992177

SN - 1757-8981

VL - 502

JO - IOP Conference Series: Materials Science and Engineering

JF - IOP Conference Series: Materials Science and Engineering

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T2 - 27th International Cryogenics Engineering Conference and International Cryogenic Materials Conference 2018

Y2 - 3 September 2018 through 7 September 2018

ER -

Heat transfer at dielectric-metallic interfaces in the ultra-low temperature range

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