High-Density Planar Integrated Magnetics with Common Mode Noise Immunity

Junyun Deng, Wenbo Wang, Prasanth Venugopal, Jelena Popovic, Gert Rietveld

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
203 Downloads (Pure)

Abstract

Integrating inductors and transformers into one planar component becomes a critical approach to realize high power density. However, due to large overlapped areas, the common-mode (CM) noise current in planar transformers increase significantly. In reported works, magnetic integration and common-mode noise suppression are rarely simultaneously considered in design optimization. In this paper, the strengths and drawbacks of different magnetic integration techniques, especially about CM noise reduction, are investigated. To enhance CM noise immunity, a symmetrical integrated magnetic module is developed, which also features lower magnetic loss and flexible parameter regulation. To validate the proposed concept, a detailed analysis is performed and an experimental prototype is built.

Original languageEnglish
Title of host publicationAPEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages3269-3274
Number of pages6
ISBN (Electronic)978-1-6654-7539-6, 978-1-6654-7538-9 (USB)
ISBN (Print)978-1-6654-7540-2
DOIs
Publication statusPublished - 2023
Event38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023 - Orlando, United States
Duration: 19 Mar 202323 Mar 2023
Conference number: 38

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
PublisherIEEE
Volume2023
ISSN (Print)1048-2334
ISSN (Electronic)2470-6647

Conference

Conference38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023
Abbreviated titleAPEC 2023
Country/TerritoryUnited States
CityOrlando
Period19/03/2323/03/23

Keywords

  • Common-mode noise suppression
  • Magnetic integration
  • Planar magnetic components
  • 2023 OA procedure

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