High force 10 kN piezoresistive silicon force sensor with output independent of force distribution

A.F. Zwijze, Remco J. Wiegerink, Gijsbertus J.M. Krijnen, Johan W. Berenschot, Meint J. de Boer, Michael Curt Elwenspoek

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    Abstract

    A 10 kN silicon force sensor is realized in which the force is measured by compressing a meander shaped polysilicon strain gage. A second gage which is not loaded, is used for temperature compensation, for compensation of bending and stretching stresses in the chip and for common changes in zero load resistor values. It is shown that the output of the bridge is a linear function of the force and is independent of the force distribution on the chip. By measuring the resistance change along both gages, the force distribution on the chip can be determined so that it can be detected whether the sensor has an oblique load or not. The production process of the chip is simple and robust. A package is designed to apply the load. Hysteresis experiments are performed at four temperatures between 25 °C and 47 °C. Hysteresis measurements at room temperature are in close agreement with finite element calculations. The maximum hysteresis error is within &plusmn0.14% of the full-scale output (fso). Creep was tested by loading it five times. It follows that creep is smaller than 0.01% of the fso. The total error including interpolation error is within &plusmn0.23%.
    Original languageUndefined
    Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
    EditorsEric Peeters, Oliver Paul
    Place of PublicationBellingham, WA, USA
    PublisherSPIE
    Pages47-58
    Number of pages12
    DOIs
    Publication statusPublished - 18 Sep 2000
    EventMicromachined Devices and Components VI, Santa Clara, USA, September 18, 2000: Proceedings of SPIE's Micromachined Devices and Components VI -
    Duration: 18 Sep 2000 → …

    Publication series

    NameProceedings of SPIE
    PublisherSPIE
    Volume4176
    ISSN (Print)0277-786X

    Conference

    ConferenceMicromachined Devices and Components VI, Santa Clara, USA, September 18, 2000
    Period18/09/00 → …

    Keywords

    • EWI-12919
    • IR-16246
    • METIS-113131

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