High-frequency SiGe HBT's with implanted emitters

L.K. Nanver*, E.J.G. Goudena, C. Visser, H.W. van Zeijl, J.W. Slotboom

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
6 Downloads (Pure)

Abstract

A method is presented by which the implantation damage induced transient enhanced diffusion of boron and phosphorus is used to fabricate high-frequency SiGe HBT's with implanted emitters. A device with 30 nm basewidth and fT= 44 GHz is demonstrated.

Original languageEnglish
Title of host publicationESSDERC 1996 - Proceedings of the 26th European Solid State Device Research Conference
EditorsMassimo Rudan, Giorgio Baccarani
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages469-472
Number of pages4
ISBN (Print)9782863321966
Publication statusPublished - 1 Jan 1996
Externally publishedYes
Event26th European Solid State Device Research Conference, ESSDERC 1996 - Bologna, Italy
Duration: 9 Sept 199611 Sept 1996
Conference number: 26

Conference

Conference26th European Solid State Device Research Conference, ESSDERC 1996
Abbreviated titleESSDERC
Country/TerritoryItaly
CityBologna
Period9/09/9611/09/96

Fingerprint

Dive into the research topics of 'High-frequency SiGe HBT's with implanted emitters'. Together they form a unique fingerprint.

Cite this