High power Si sidewall heaters for fluidic application fabricated by trench-assisted surface channel technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

We have fabricated mechanically stable, thermally isolated microfluidic channels with silicon heaters embedded in the sidewalls, using the trench-assisted surface channel technology (TASCT). Sidewall heating results in an enhanced heating uniformity while allowing high heating powers because of the relatively large crosssectional area (20 μm by 50 μm) of the silicon heaters. In the proof-of-principle device a maximum temperature of 406 °C was reached at a heating power of 1.4 W, limited by thermal expansion of the channel. The fabrication process enables both the channels and the silicon heaters to have a rectangular cross-section with a depth defined by the device layer thickness and a variable width and length.
Original languageEnglish
Title of host publication2019 IEEE 32nd Conference on Micro Electro Mechanical Systems (MEMS)
PublisherIEEE
Pages648-651
Number of pages4
Volume32
Publication statusPublished - Jan 2019
Event32nd IEEE International Conference on Micro Electro Mechanical Systems 2019 - Seoul, Korea, Republic of
Duration: 27 Jan 201931 Jan 2019
Conference number: 32
http://www.mems19.org/html/main.php

Conference

Conference32nd IEEE International Conference on Micro Electro Mechanical Systems 2019
Abbreviated titleMEMS 2019
CountryKorea, Republic of
CitySeoul
Period27/01/1931/01/19
Internet address

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fluidics
heaters
heating
silicon
thermal expansion
fabrication
cross sections
temperature

Cite this

Veltkamp, H-W., Zhao, Y., de Boer, M. J., Sanders, R. G. P., Wiegerink, R. J., & Lötters, J. C. (2019). High power Si sidewall heaters for fluidic application fabricated by trench-assisted surface channel technology. In 2019 IEEE 32nd Conference on Micro Electro Mechanical Systems (MEMS) (Vol. 32, pp. 648-651). IEEE.
Veltkamp, Henk-Willem ; Zhao, Yiyuan ; de Boer, Meint J. ; Sanders, Remco G.P. ; Wiegerink, Remco J. ; Lötters, Joost Conrad. / High power Si sidewall heaters for fluidic application fabricated by trench-assisted surface channel technology. 2019 IEEE 32nd Conference on Micro Electro Mechanical Systems (MEMS). Vol. 32 IEEE, 2019. pp. 648-651
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title = "High power Si sidewall heaters for fluidic application fabricated by trench-assisted surface channel technology",
abstract = "We have fabricated mechanically stable, thermally isolated microfluidic channels with silicon heaters embedded in the sidewalls, using the trench-assisted surface channel technology (TASCT). Sidewall heating results in an enhanced heating uniformity while allowing high heating powers because of the relatively large crosssectional area (20 μm by 50 μm) of the silicon heaters. In the proof-of-principle device a maximum temperature of 406 °C was reached at a heating power of 1.4 W, limited by thermal expansion of the channel. The fabrication process enables both the channels and the silicon heaters to have a rectangular cross-section with a depth defined by the device layer thickness and a variable width and length.",
author = "Henk-Willem Veltkamp and Yiyuan Zhao and {de Boer}, {Meint J.} and Sanders, {Remco G.P.} and Wiegerink, {Remco J.} and L{\"o}tters, {Joost Conrad}",
year = "2019",
month = "1",
language = "English",
volume = "32",
pages = "648--651",
booktitle = "2019 IEEE 32nd Conference on Micro Electro Mechanical Systems (MEMS)",
publisher = "IEEE",
address = "United States",

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Veltkamp, H-W, Zhao, Y, de Boer, MJ, Sanders, RGP, Wiegerink, RJ & Lötters, JC 2019, High power Si sidewall heaters for fluidic application fabricated by trench-assisted surface channel technology. in 2019 IEEE 32nd Conference on Micro Electro Mechanical Systems (MEMS). vol. 32, IEEE, pp. 648-651, 32nd IEEE International Conference on Micro Electro Mechanical Systems 2019, Seoul, Korea, Republic of, 27/01/19.

High power Si sidewall heaters for fluidic application fabricated by trench-assisted surface channel technology. / Veltkamp, Henk-Willem ; Zhao, Yiyuan ; de Boer, Meint J.; Sanders, Remco G.P.; Wiegerink, Remco J.; Lötters, Joost Conrad.

2019 IEEE 32nd Conference on Micro Electro Mechanical Systems (MEMS). Vol. 32 IEEE, 2019. p. 648-651.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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AU - Veltkamp, Henk-Willem

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AU - de Boer, Meint J.

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AU - Wiegerink, Remco J.

AU - Lötters, Joost Conrad

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N2 - We have fabricated mechanically stable, thermally isolated microfluidic channels with silicon heaters embedded in the sidewalls, using the trench-assisted surface channel technology (TASCT). Sidewall heating results in an enhanced heating uniformity while allowing high heating powers because of the relatively large crosssectional area (20 μm by 50 μm) of the silicon heaters. In the proof-of-principle device a maximum temperature of 406 °C was reached at a heating power of 1.4 W, limited by thermal expansion of the channel. The fabrication process enables both the channels and the silicon heaters to have a rectangular cross-section with a depth defined by the device layer thickness and a variable width and length.

AB - We have fabricated mechanically stable, thermally isolated microfluidic channels with silicon heaters embedded in the sidewalls, using the trench-assisted surface channel technology (TASCT). Sidewall heating results in an enhanced heating uniformity while allowing high heating powers because of the relatively large crosssectional area (20 μm by 50 μm) of the silicon heaters. In the proof-of-principle device a maximum temperature of 406 °C was reached at a heating power of 1.4 W, limited by thermal expansion of the channel. The fabrication process enables both the channels and the silicon heaters to have a rectangular cross-section with a depth defined by the device layer thickness and a variable width and length.

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Veltkamp H-W, Zhao Y, de Boer MJ, Sanders RGP, Wiegerink RJ, Lötters JC. High power Si sidewall heaters for fluidic application fabricated by trench-assisted surface channel technology. In 2019 IEEE 32nd Conference on Micro Electro Mechanical Systems (MEMS). Vol. 32. IEEE. 2019. p. 648-651