High Power Si Sidewall Heaters for Fluidic Applications Fabricated by Trench-Assisted Surface Channel Technology

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    Abstract

    We have fabricated mechanically stable, thermally isolated microfluidic channels with silicon heaters embedded in the sidewalls, using the trench-assisted surface channel technology (TASCT) [1]. Sidewall heating results in an enhanced heating uniformity while allowing high heating powers because of the relatively large cross-sectional area (20 μm by 50 μm) of the silicon heaters. In the proof-of-principle device a maximum temperature of 406 °C was reached at a heating power of 1.4 W, limited by thermal expansion of the channel. The fabrication process enables both the channels and the silicon heaters to have a rectangular cross-section with a depth defined by the device layer thickness and a variable width and length.

    Original languageEnglish
    Title of host publication2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
    PublisherIEEE
    Pages648-651
    Number of pages4
    ISBN (Electronic)9781728116105
    DOIs
    Publication statusPublished - 17 Oct 2019
    Event32nd IEEE International Conference on Micro Electro Mechanical Systems 2019 - Seoul, Korea, Republic of
    Duration: 27 Jan 201931 Jan 2019
    Conference number: 32
    http://www.mems19.org/html/main.php

    Conference

    Conference32nd IEEE International Conference on Micro Electro Mechanical Systems 2019
    Abbreviated titleMEMS 2019
    CountryKorea, Republic of
    CitySeoul
    Period27/01/1931/01/19
    Internet address

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  • Cite this

    Veltkamp, H. W., Zhao, Y., De Boer, M. J., Sanders, R. G. P., Wiegerink, R. J., & Lotters, J. C. (2019). High Power Si Sidewall Heaters for Fluidic Applications Fabricated by Trench-Assisted Surface Channel Technology. In 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019 (pp. 648-651). [8870667] IEEE. https://doi.org/10.1109/MEMSYS.2019.8870667