High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through

G.J. Burger, E.J.T. Smulders, J.W. Berenschot, T.S.J. Lammerink, J.H.J. Fluitman, S. Imai

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    8 Citations (Scopus)
    196 Downloads (Pure)

    Abstract

    This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, E-beam evaporation of metals through a shadow mask, is used [1]. The realisation of high resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed through with a small parasitic capacitance to the substrate and a high placing density is presented.
    Original languageUndefined
    Title of host publicationTransducers '95 - Eurosensors XI
    Subtitle of host publicationProceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX
    Place of PublicationPiscataway, NJ
    PublisherIEEE
    Pages573-576
    Number of pages4
    Volume1
    ISBN (Print)91-630-3473-5
    DOIs
    Publication statusPublished - 25 Jun 1995
    EventTransducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors - Stockholm, Sweden
    Duration: 25 Jun 199529 Jun 1995
    Conference number: 9

    Conference

    ConferenceTransducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors
    CountrySweden
    CityStockholm
    Period25/06/9529/06/95

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