High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through

G.J. Burger; E.J.T. Smulders; J.W. Berenschot; T.S.J. Lammerink; J.H.J. Fluitman; S. Imai

doi:10.1109/SENSOR.1995.717289

High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through

G.J. Burger, E.J.T. Smulders, J.W. Berenschot, T.S.J. Lammerink, J.H.J. Fluitman, S. Imai

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

10 Citations (Scopus)

758 Downloads (Pure)

Abstract

This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, E-beam evaporation of metals through a shadow mask, is used [1]. The realisation of high resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed through with a small parasitic capacitance to the substrate and a high placing density is presented.

Original language	Undefined
Title of host publication	Transducers '95 - Eurosensors XI
Subtitle of host publication	Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	573-576
Number of pages	4
Volume	1
ISBN (Print)	91-630-3473-5
DOIs	https://doi.org/10.1109/SENSOR.1995.717289
Publication status	Published - 25 Jun 1995
Event	Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors - Stockholm, Sweden Duration: 25 Jun 1995 → 29 Jun 1995 Conference number: 9

Conference

Conference	Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors
Country/Territory	Sweden
City	Stockholm
Period	25/06/95 → 29/06/95

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This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/SENSOR.1995.717289

Burger1995highFinal published version, 925 KB

Cite this

Burger, G. J., Smulders, E. J. T., Berenschot, J. W., Lammerink, T. S. J., Fluitman, J. H. J., & Imai, S. (1995). High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through. In Transducers '95 - Eurosensors XI: Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX (Vol. 1, pp. 573-576). IEEE. https://doi.org/10.1109/SENSOR.1995.717289

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title = "High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through",

abstract = "This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, E-beam evaporation of metals through a shadow mask, is used [1]. The realisation of high resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed through with a small parasitic capacitance to the substrate and a high placing density is presented.",

author = "G.J. Burger and E.J.T. Smulders and J.W. Berenschot and T.S.J. Lammerink and J.H.J. Fluitman and S. Imai",

year = "1995",

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doi = "10.1109/SENSOR.1995.717289",

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booktitle = "Transducers '95 - Eurosensors XI",

publisher = "IEEE",

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Burger, GJ, Smulders, EJT, Berenschot, JW, Lammerink, TSJ, Fluitman, JHJ & Imai, S 1995, High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through. in Transducers '95 - Eurosensors XI: Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. vol. 1, IEEE, Piscataway, NJ, pp. 573-576, Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors, Stockholm, Sweden, 25/06/95. https://doi.org/10.1109/SENSOR.1995.717289

High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through. / Burger, G.J.; Smulders, E.J.T.; Berenschot, J.W. et al.
Transducers '95 - Eurosensors XI: Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Vol. 1 Piscataway, NJ: IEEE, 1995. p. 573-576.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through

AU - Burger, G.J.

AU - Smulders, E.J.T.

AU - Berenschot, J.W.

AU - Lammerink, T.S.J.

AU - Fluitman, J.H.J.

AU - Imai, S.

N1 - Conference code: 9

PY - 1995/6/25

Y1 - 1995/6/25

N2 - This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, E-beam evaporation of metals through a shadow mask, is used [1]. The realisation of high resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed through with a small parasitic capacitance to the substrate and a high placing density is presented.

AB - This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, E-beam evaporation of metals through a shadow mask, is used [1]. The realisation of high resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed through with a small parasitic capacitance to the substrate and a high placing density is presented.

U2 - 10.1109/SENSOR.1995.717289

DO - 10.1109/SENSOR.1995.717289

M3 - Conference contribution

SN - 91-630-3473-5

VL - 1

SP - 573

EP - 576

BT - Transducers '95 - Eurosensors XI

PB - IEEE

CY - Piscataway, NJ

T2 - Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors

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Burger GJ, Smulders EJT, Berenschot JW, Lammerink TSJ, Fluitman JHJ, Imai S. High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through. In Transducers '95 - Eurosensors XI: Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Vol. 1. Piscataway, NJ: IEEE. 1995. p. 573-576 doi: 10.1109/SENSOR.1995.717289