TY - JOUR
T1 - High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through
AU - Burger, G.J.
AU - Smulders, E.J.T.
AU - Berenschot, J.W.
AU - Lammerink, T.S.J.
AU - Fluitman, J.H.J.
AU - Imai, S.
PY - 1996/6
Y1 - 1996/6
N2 - This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed-through with a small parasitic capacitance to the substrate and a high placing density is presented.
AB - This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed-through with a small parasitic capacitance to the substrate and a high placing density is presented.
U2 - 10.1016/S0924-4247(97)80035-0
DO - 10.1016/S0924-4247(97)80035-0
M3 - Article
VL - 54
SP - 669
EP - 673
JO - Sensors and actuators. A: Physical
JF - Sensors and actuators. A: Physical
SN - 0924-4247
IS - 1-3
ER -