High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through

G.J. Burger, E.J.T. Smulders, J.W. Berenschot, T.S.J. Lammerink, J.H.J. Fluitman, S. Imai

    Research output: Contribution to journalArticleAcademicpeer-review

    46 Citations (Scopus)
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    Abstract

    This paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed-through with a small parasitic capacitance to the substrate and a high placing density is presented.
    Original languageEnglish
    Pages (from-to)669-673
    Number of pages5
    JournalSensors and actuators. A: Physical
    Volume54
    Issue number1-3
    DOIs
    Publication statusPublished - Jun 1996

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