How to Solve the Main Reliability Problem in Future IC Devices: Modeling the Stress and Electromigration

M. Dekker, V. Petrescu, M. Rijnsburger, Cora Salm, A.J. Mouthaan

    Research output: Other contributionOther research output

    Original languageUndefined
    Place of PublicationEnschede, the Netherlands
    Publication statusPublished - 23 Jun 1998

    Keywords

    • METIS-114891

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