TY - UNPB
T1 - Hybrid integrated near UV lasers using the deep-UV Al2O3 platform
AU - Franken, C.A.A.
AU - Hendriks, W.A.P.M.
AU - Winkler, L.V.
AU - Dijkstra, M.
AU - do Nascimento Jr., A.R.
AU - van Rees, A.
AU - Mardani, M.R.S.
AU - Dekker, R.
AU - van Kerkhof, J.
AU - van der Slot, P.J.M.
AU - García Blanco, S.M.
AU - Boller, K.-J.
PY - 2023/2/22
Y1 - 2023/2/22
N2 - Hybrid integrated diode lasers have so far been realized using silicon, polymer, and silicon nitride (Si3N4) waveguide platforms for extending on-chip tunable light engines from the infrared throughout the visible range. Here we demonstrate the first hybrid integrated laser using the aluminum oxide (Al2O3) deep-UV capable waveguide platform. By permanently coupling low-loss Al2O3 frequency-tunable Vernier feedback circuits with GaN double-pass amplifiers in a hermetically sealed housing, we demonstrate the first extended cavity diode laser (ECDL) in the near UV. The laser shows a maximum fiber-coupled output power of 0.74 mW, corresponding to about 3.5 mW on chip, and tunes more than 4.4 nm in wavelength from 408.1 nm to 403.7 nm. Integrating stable, single-mode and tunable lasers into a deep-UV platform opens a new path for chip-integrated photonic applications.
AB - Hybrid integrated diode lasers have so far been realized using silicon, polymer, and silicon nitride (Si3N4) waveguide platforms for extending on-chip tunable light engines from the infrared throughout the visible range. Here we demonstrate the first hybrid integrated laser using the aluminum oxide (Al2O3) deep-UV capable waveguide platform. By permanently coupling low-loss Al2O3 frequency-tunable Vernier feedback circuits with GaN double-pass amplifiers in a hermetically sealed housing, we demonstrate the first extended cavity diode laser (ECDL) in the near UV. The laser shows a maximum fiber-coupled output power of 0.74 mW, corresponding to about 3.5 mW on chip, and tunes more than 4.4 nm in wavelength from 408.1 nm to 403.7 nm. Integrating stable, single-mode and tunable lasers into a deep-UV platform opens a new path for chip-integrated photonic applications.
U2 - 10.48550/arXiv.2302.11492
DO - 10.48550/arXiv.2302.11492
M3 - Working paper
BT - Hybrid integrated near UV lasers using the deep-UV Al2O3 platform
PB - ArXiv.org
ER -