Abstract
The application of commercial 3-D software `COSMOS' for the design and thermal analysis of the low power consumption test structures with dielectric membrane for gas microsensors is presented. Within this work, the simulation provides the estimation of the temperature profile on the active area and the whole membrane including the four bridges and the heating efficiency in the temperature range 20-500 °C. Unravelling of the heat loss mechanisms in terms of radiation, convection, conduction by air and solid materials during heat transfer on the dielectric membrane is reported for the first time as a mean to evaluate by 3-D simulation the contribution of technological processes and lay-out design to the total heat losses.
Original language | Undefined |
---|---|
Pages | 145-148 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 7 Oct 1997 |
Event | 20th International Semiconductor Conference, CAS'97 - Sinaia, Romania Duration: 7 Oct 1997 → 11 Oct 1997 Conference number: 20 |
Conference
Conference | 20th International Semiconductor Conference, CAS'97 |
---|---|
Abbreviated title | CAS 1997 |
Country/Territory | Romania |
City | Sinaia |
Period | 7/10/97 → 11/10/97 |
Keywords
- EWI-13540
- IR-65021