Imaging of copper ejection in pico- and nanosecond laser induced forward transfer

A.J. Huis in 't Veld; M.B. Hoppenbrouwers; M. Giesbers; R. Pohl; G.R.B.E. Römer; C.W. Visser; C. Sun; D. Lohse

doi:10.3850/978-981-07-7247-5-420

Imaging of copper ejection in pico- and nanosecond laser induced forward transfer

A.J. Huis in 't Veld
, M.B. Hoppenbrouwers
, M. Giesbers
, R. Pohl
, G.R.B.E. Römer
, C.W. Visser
, C. Sun
, D. Lohse

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the 10th International Conference on Multi Material Micro Manufacture
Editors	S. Azcárate, S. Dimov
Place of Publication	San Sebastian, Spain
Publisher	Research Publishing
Pages	160-163
ISBN (Electronic)	978-981-07-7248-2 (CD-ROM)
ISBN (Print)	978-981-07-7247-5
DOIs	https://doi.org/10.3850/978-981-07-7247-5-420
Publication status	Published - 8 Oct 2013
Event	10th International Conference on Multi Material Micro Manufacture 2013 - San Sebastian, Spain Duration: 8 Oct 2013 → 10 Oct 2013

Conference

Conference	10th International Conference on Multi Material Micro Manufacture 2013
Country/Territory	Spain
City	San Sebastian
Period	8/10/13 → 10/10/13

Access to Document

10.3850/978-981-07-7247-5-420

Cite this

Huis in 't Veld, A. J., Hoppenbrouwers, M. B., Giesbers, M., Pohl, R., Römer, G. R. B. E., Visser, C. W., Sun, C., & Lohse, D. (2013). Imaging of copper ejection in pico- and nanosecond laser induced forward transfer. In S. Azcárate, & S. Dimov (Eds.), Proceedings of the 10th International Conference on Multi Material Micro Manufacture (pp. 160-163). Research Publishing. https://doi.org/10.3850/978-981-07-7247-5-420

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title = "Imaging of copper ejection in pico- and nanosecond laser induced forward transfer",

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year = "2013",

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doi = "10.3850/978-981-07-7247-5-420",

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note = "10th International Conference on Multi Material Micro Manufacture 2013 ; Conference date: 08-10-2013 Through 10-10-2013",

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Huis in 't Veld, AJ, Hoppenbrouwers, MB, Giesbers, M, Pohl, R , Römer, GRBE , Visser, CW , Sun, C & Lohse, D 2013, Imaging of copper ejection in pico- and nanosecond laser induced forward transfer. in S Azcárate & S Dimov (eds), Proceedings of the 10th International Conference on Multi Material Micro Manufacture. Research Publishing, San Sebastian, Spain, pp. 160-163, 10th International Conference on Multi Material Micro Manufacture 2013, San Sebastian, Spain, 8/10/13. https://doi.org/10.3850/978-981-07-7247-5-420

Imaging of copper ejection in pico- and nanosecond laser induced forward transfer. / Huis in 't Veld, A.J.; Hoppenbrouwers, M.B.; Giesbers, M. et al.
Proceedings of the 10th International Conference on Multi Material Micro Manufacture. ed. / S. Azcárate; S. Dimov. San Sebastian, Spain: Research Publishing, 2013. p. 160-163.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Imaging of copper ejection in pico- and nanosecond laser induced forward transfer

AU - Huis in 't Veld, A.J.

AU - Hoppenbrouwers, M.B.

AU - Giesbers, M.

AU - Pohl, R.

AU - Römer, G.R.B.E.

AU - Visser, C.W.

AU - Sun, C.

AU - Lohse, D.

PY - 2013/10/8

Y1 - 2013/10/8

U2 - 10.3850/978-981-07-7247-5-420

DO - 10.3850/978-981-07-7247-5-420

M3 - Conference contribution

SN - 978-981-07-7247-5

SP - 160

EP - 163

BT - Proceedings of the 10th International Conference on Multi Material Micro Manufacture

A2 - Azcárate, S.

A2 - Dimov, S.

PB - Research Publishing

CY - San Sebastian, Spain

T2 - 10th International Conference on Multi Material Micro Manufacture 2013

Y2 - 8 October 2013 through 10 October 2013

ER -

Huis in 't Veld AJ, Hoppenbrouwers MB, Giesbers M, Pohl R , Römer GRBE , Visser CW et al. Imaging of copper ejection in pico- and nanosecond laser induced forward transfer. In Azcárate S, Dimov S, editors, Proceedings of the 10th International Conference on Multi Material Micro Manufacture. San Sebastian, Spain: Research Publishing. 2013. p. 160-163 doi: 10.3850/978-981-07-7247-5-420