Impacts of Process Conditions on the Uniformity of Material Removal Rate in Chemical Mechanical Polishing Process

V. Nguyen Hoang, H. van Kranenburg, P. van der Velden, R. Daamen, P.H. Woerlee

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of SAFE conference 2000
    Place of PublicationVeldhoven, The Netherlands
    Publication statusPublished - 29 Nov 2000


    • METIS-113951

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