Improving Thermal Contact Conductance from Electronics Board to Rack Infrastructure

Jeroen Terpstra, Wessel W. Wits*

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    1 Citation (Scopus)

    Abstract

    This paper presents experimental results of thermal contact conductance between an electronics board and rack infrastructure. For line replaceable units using liquid conduction cooling, the baseplate-cold plate interface introduces a critical thermal resistance. Using a dedicated experimental set-up that measures temperature gradients across such interfaces, this study systematically analyses key design parameters, such as surface roughness, contact pressure, coatings, such as nickel and tin plating, and the application of indium as thermal interface material. Limitations of theoretical models are addressed demonstrating the importance of experimental testing. Empirical results of this study show that coldplate plating and the use of indium have the most impact on the interface heat transfer coefficient. The presented results enable design engineers to improve thermal contact conductance thereby extending the range of liquid conduction cooling for cases in which electronics boards are clamped into a rack infrastructure.

    Original languageEnglish
    Title of host publicationTHERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
    PublisherIEEE
    ISBN (Electronic)9781538667590
    DOIs
    Publication statusPublished - 27 Dec 2018
    Event24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 - Scandic Victoria Tower, Stockholm, Sweden
    Duration: 26 Sep 201828 Sep 2018
    Conference number: 24
    https://therminic2018.eu/

    Conference

    Conference24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018
    Abbreviated titleTHERMINIC 2018
    Country/TerritorySweden
    CityStockholm
    Period26/09/1828/09/18
    Internet address

    Fingerprint

    Dive into the research topics of 'Improving Thermal Contact Conductance from Electronics Board to Rack Infrastructure'. Together they form a unique fingerprint.

    Cite this