Improving Thermal Contact Conductance from Electronics Board to Rack Infrastructure

Jeroen Terpstra, Wessel W. Wits*

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    1 Citation (Scopus)

    Fingerprint

    Dive into the research topics of 'Improving Thermal Contact Conductance from Electronics Board to Rack Infrastructure'. Together they form a unique fingerprint.

    Physics & Astronomy

    Engineering & Materials Science

    Chemistry