Abstract
The reflectance measurement during the selective deposition of W on Si covered with an insulator grating is proven tobe a convenient method to monitor the W deposition. The reflectance change during deposition allows the in situ measurementof the deposition rate. The influence of surface roughening due to either the W growth or an etching pretreatmentof the wafer is modeled, as well as the effect of selectivity loss and lateral overgrowth.
Original language | English |
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Pages (from-to) | 989-992 |
Journal | Journal of the Electrochemical Society |
Volume | 138 |
Issue number | 4 |
DOIs | |
Publication status | Published - 1991 |