Incorporation of in-plane electrical internonnects to the reflow bonding

B. Mogulkoc, Henricus V. Jansen, Hermanus J.M. ter Brake, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

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Abstract

This paper elaborates on the incorporation of in-plane electrical interconnects to the reflow bonding. After joining the tubes to silicon substrates, the electrically conductive lines will allow probing into the volume confined by the tube. Therefore methods of fabrication of electrical interconnects, which would survive the bonding and not alter the quality of the bond interface, are investigated.
Original languageUndefined
Title of host publication21st Micromechanics and Micro systems Europe workshop (MME2010)
Place of PublicationEnschede
PublisherUniversiteit Twente - TST
Pages1-4
Number of pages4
ISBN (Print)978-90-81673716
Publication statusPublished - 26 Sep 2010
Event21st Micromechanics and Microsystems Europe Workshop, MME 2010 - University of Twente, Enschede, Netherlands
Duration: 26 Sep 201029 Sep 2010
Conference number: 21

Publication series

Name
PublisherUniversiteit Twente - TST

Workshop

Workshop21st Micromechanics and Microsystems Europe Workshop, MME 2010
Abbreviated titleMME
CountryNetherlands
CityEnschede
Period26/09/1029/09/10

Keywords

  • IR-73517
  • METIS-275666
  • EWI-18542
  • electrical interconnects
  • Reflow bonding
  • fluidic interconnects

Cite this

Mogulkoc, B., Jansen, H. V., ter Brake, H. J. M., & Elwenspoek, M. C. (2010). Incorporation of in-plane electrical internonnects to the reflow bonding. In 21st Micromechanics and Micro systems Europe workshop (MME2010) (pp. 1-4). Enschede: Universiteit Twente - TST.