Incorporation of in-plane electrical internonnects to the reflow bonding

B. Mogulkoc, Henricus V. Jansen, Hermanus J.M. ter Brake, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

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Abstract

This paper elaborates on the incorporation of in-plane electrical interconnects to the reflow bonding. After joining the tubes to silicon substrates, the electrically conductive lines will allow probing into the volume confined by the tube. Therefore methods of fabrication of electrical interconnects, which would survive the bonding and not alter the quality of the bond interface, are investigated.
Original languageUndefined
Title of host publication21st Micromechanics and Micro systems Europe workshop (MME2010)
Place of PublicationEnschede
PublisherUniversiteit Twente - TST
Pages1-4
Number of pages4
ISBN (Print)978-90-81673716
Publication statusPublished - 26 Sep 2010
Event21st Micromechanics and Microsystems Europe Workshop, MME 2010 - University of Twente, Enschede, Netherlands
Duration: 26 Sep 201029 Sep 2010
Conference number: 21

Publication series

Name
PublisherUniversiteit Twente - TST

Workshop

Workshop21st Micromechanics and Microsystems Europe Workshop, MME 2010
Abbreviated titleMME
CountryNetherlands
CityEnschede
Period26/09/1029/09/10

Keywords

  • IR-73517
  • METIS-275666
  • EWI-18542
  • electrical interconnects
  • Reflow bonding
  • fluidic interconnects

Cite this

Mogulkoc, B., Jansen, H. V., ter Brake, H. J. M., & Elwenspoek, M. C. (2010). Incorporation of in-plane electrical internonnects to the reflow bonding. In 21st Micromechanics and Micro systems Europe workshop (MME2010) (pp. 1-4). Enschede: Universiteit Twente - TST.
Mogulkoc, B. ; Jansen, Henricus V. ; ter Brake, Hermanus J.M. ; Elwenspoek, Michael Curt. / Incorporation of in-plane electrical internonnects to the reflow bonding. 21st Micromechanics and Micro systems Europe workshop (MME2010). Enschede : Universiteit Twente - TST, 2010. pp. 1-4
@inproceedings{8474e433743f457e9a66bb5011621cf4,
title = "Incorporation of in-plane electrical internonnects to the reflow bonding",
abstract = "This paper elaborates on the incorporation of in-plane electrical interconnects to the reflow bonding. After joining the tubes to silicon substrates, the electrically conductive lines will allow probing into the volume confined by the tube. Therefore methods of fabrication of electrical interconnects, which would survive the bonding and not alter the quality of the bond interface, are investigated.",
keywords = "IR-73517, METIS-275666, EWI-18542, electrical interconnects, Reflow bonding, fluidic interconnects",
author = "B. Mogulkoc and Jansen, {Henricus V.} and {ter Brake}, {Hermanus J.M.} and Elwenspoek, {Michael Curt}",
year = "2010",
month = "9",
day = "26",
language = "Undefined",
isbn = "978-90-81673716",
publisher = "Universiteit Twente - TST",
pages = "1--4",
booktitle = "21st Micromechanics and Micro systems Europe workshop (MME2010)",

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Mogulkoc, B, Jansen, HV, ter Brake, HJM & Elwenspoek, MC 2010, Incorporation of in-plane electrical internonnects to the reflow bonding. in 21st Micromechanics and Micro systems Europe workshop (MME2010). Universiteit Twente - TST, Enschede, pp. 1-4, 21st Micromechanics and Microsystems Europe Workshop, MME 2010, Enschede, Netherlands, 26/09/10.

Incorporation of in-plane electrical internonnects to the reflow bonding. / Mogulkoc, B.; Jansen, Henricus V.; ter Brake, Hermanus J.M.; Elwenspoek, Michael Curt.

21st Micromechanics and Micro systems Europe workshop (MME2010). Enschede : Universiteit Twente - TST, 2010. p. 1-4.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

TY - GEN

T1 - Incorporation of in-plane electrical internonnects to the reflow bonding

AU - Mogulkoc, B.

AU - Jansen, Henricus V.

AU - ter Brake, Hermanus J.M.

AU - Elwenspoek, Michael Curt

PY - 2010/9/26

Y1 - 2010/9/26

N2 - This paper elaborates on the incorporation of in-plane electrical interconnects to the reflow bonding. After joining the tubes to silicon substrates, the electrically conductive lines will allow probing into the volume confined by the tube. Therefore methods of fabrication of electrical interconnects, which would survive the bonding and not alter the quality of the bond interface, are investigated.

AB - This paper elaborates on the incorporation of in-plane electrical interconnects to the reflow bonding. After joining the tubes to silicon substrates, the electrically conductive lines will allow probing into the volume confined by the tube. Therefore methods of fabrication of electrical interconnects, which would survive the bonding and not alter the quality of the bond interface, are investigated.

KW - IR-73517

KW - METIS-275666

KW - EWI-18542

KW - electrical interconnects

KW - Reflow bonding

KW - fluidic interconnects

M3 - Conference contribution

SN - 978-90-81673716

SP - 1

EP - 4

BT - 21st Micromechanics and Micro systems Europe workshop (MME2010)

PB - Universiteit Twente - TST

CY - Enschede

ER -

Mogulkoc B, Jansen HV, ter Brake HJM, Elwenspoek MC. Incorporation of in-plane electrical internonnects to the reflow bonding. In 21st Micromechanics and Micro systems Europe workshop (MME2010). Enschede: Universiteit Twente - TST. 2010. p. 1-4