Incorporation of in-plane interconnects to reflow bonding for electrical functionality

B. Moǧulkoç*, H. V. Jansen, H. J.M. Ter Brake, M. C. Elwenspoek

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

Incorporation of in-plane electrical interconnects to reflow bonding is studied to provide electrical functionality to lab-on-a-chip or microfluidic devices. Reflow bonding is the packaging technology, in which glass tubes are joined to silicon substrates at elevated temperatures. The tubes are used to interface the silicon-based fluidic devices and are directly compatible with standard Swagelok® connectors. After the bonding, the electrically conductive lines will allow probing into the volume confined by the tube, where the fluidic device operates. Therefore methods for fabricating electrical interconnects that survive the bonding procedure at elevated temperature and do not alter the properties of the bond interface are investigated.

Original languageEnglish
Article number074002
JournalJournal of micromechanics and microengineering
Volume21
Issue number7
DOIs
Publication statusPublished - 1 Jul 2011

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