Abstract
We report on two novel capacitive pressure sensing mechanisms that allow measurements inline with other fluidic devices on one chip, without introducing a large internal volume to the fluid path. The first sensing mechanism is based on out-of-plane bending of a U-shaped channel and the same structure could be used for thermal flow sensing simultaneously. The second mechanism is based on deformation of the cross-section of the tube and allows for differential capacitive readout. The sensitivity and range of both mechanisms are scalable. The current implementations are tested up to 2.45 bar and 1 bar respectively.
Original language | English |
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Title of host publication | 18th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2015 |
Publisher | The Printing House, Inc. |
Pages | 1187-1190 |
Number of pages | 4 |
ISBN (Print) | 978-1-4799-8955-3 |
DOIs | |
Publication status | Published - 21 Jun 2015 |
Event | 18th International Conference on Solid-State Sensors, Actuators and Microsystems 2015 - Dena'ina Convention Center, Anchorage, United States Duration: 21 Jun 2015 → 25 Jun 2015 Conference number: 18 http://www.transducers2015.org/ |
Conference
Conference | 18th International Conference on Solid-State Sensors, Actuators and Microsystems 2015 |
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Abbreviated title | TRANSDUCERS 2015 |
Country/Territory | United States |
City | Anchorage |
Period | 21/06/15 → 25/06/15 |
Internet address |
Keywords
- TST-FLUID HANDLING
- Lab on a chip
- Pressure sensor
- Capacitive readout
- Surface channel technology
- 22/3 OA procedure