A new symmetrical four-wire sensor configuration has resulted in a fully integrated sound intensity sensor with significant lower noise floor and smaller size than its predecessors. An integrated sound pressure sensor was further miniaturized by using a folded "back chamber" at both sides of the chip.
|Publisher||EDA Publishing Association|
|Conference||2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2008|
|Period||9/04/08 → 11/04/08|