Integrated 3D sound intensity sensor with four-wire particle velocity sensors

Doekle Reinder Yntema; J.W. van Honschoten; Remco J. Wiegerink

doi:10.1109/DTIP.2008.4752976

Integrated 3D sound intensity sensor with four-wire particle velocity sensors

Doekle Reinder Yntema, J.W. van Honschoten, Remco J. Wiegerink

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

81 Downloads (Pure)

Abstract

A new symmetrical four-wire sensor configuration has resulted in a fully integrated sound intensity sensor with significant lower noise floor and smaller size than its predecessors. An integrated sound pressure sensor was further miniaturized by using a folded "back chamber" at both sides of the chip.

Original language	Undefined
Title of host publication	Proceedings of DTIP 2008
Place of Publication	Nice
Publisher	EDA Publishing Association
Pages	3
Number of pages	3
ISBN (Print)	978-2-35500-006-5
DOIs	https://doi.org/10.1109/DTIP.2008.4752976
Publication status	Published - May 2008
Event	2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2008 - Nice, France Duration: 9 Apr 2008 → 11 Apr 2008

Publication series

Name
Publisher	EDA Publishing Association
Volume	abs/0805-0

Conference

Conference	2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2008
Abbreviated title	DTIP
Country	France
City	Nice
Period	9/04/08 → 11/04/08

Keywords

TST-SENSORS
METIS-255419
EWI-14646
IR-65232

Access to Document

10.1109/DTIP.2008.4752976

finalpaper_yntema
open
finalpaper_yntema
open

Cite this

@inproceedings{4f71f7a164d74329bd73a9acb21b3d02,

title = "Integrated 3D sound intensity sensor with four-wire particle velocity sensors",

abstract = "A new symmetrical four-wire sensor configuration has resulted in a fully integrated sound intensity sensor with significant lower noise floor and smaller size than its predecessors. An integrated sound pressure sensor was further miniaturized by using a folded {"}back chamber{"} at both sides of the chip.",

keywords = "TST-SENSORS, METIS-255419, EWI-14646, IR-65232",

author = "Yntema, {Doekle Reinder} and {van Honschoten}, J.W. and Wiegerink, {Remco J.}",

year = "2008",

month = may,

doi = "10.1109/DTIP.2008.4752976",

language = "Undefined",

isbn = "978-2-35500-006-5",

publisher = "EDA Publishing Association",

pages = "3",

booktitle = "Proceedings of DTIP 2008",

note = "null ; Conference date: 09-04-2008 Through 11-04-2008",

}

TY - GEN

T1 - Integrated 3D sound intensity sensor with four-wire particle velocity sensors

AU - Yntema, Doekle Reinder

AU - van Honschoten, J.W.

AU - Wiegerink, Remco J.

PY - 2008/5

Y1 - 2008/5

N2 - A new symmetrical four-wire sensor configuration has resulted in a fully integrated sound intensity sensor with significant lower noise floor and smaller size than its predecessors. An integrated sound pressure sensor was further miniaturized by using a folded "back chamber" at both sides of the chip.

AB - A new symmetrical four-wire sensor configuration has resulted in a fully integrated sound intensity sensor with significant lower noise floor and smaller size than its predecessors. An integrated sound pressure sensor was further miniaturized by using a folded "back chamber" at both sides of the chip.

KW - TST-SENSORS

KW - METIS-255419

KW - EWI-14646

KW - IR-65232

U2 - 10.1109/DTIP.2008.4752976

DO - 10.1109/DTIP.2008.4752976

M3 - Conference contribution

SN - 978-2-35500-006-5

SP - 3

BT - Proceedings of DTIP 2008

PB - EDA Publishing Association

CY - Nice

Y2 - 9 April 2008 through 11 April 2008

ER -