Abstract
We present the fluidic and electrical packaging of a novel silicon-based trans-epithelial electrical resistance (TEER) sensor chip designed for a modular and standardized organ-on-chip (OoC) platform. The package comprises three key components: the housing of the TEER chip, microfluidic routing for seamless integration with the platform, and electrical connections to a platform-integrated potentiostat. This modular solution enables continuous impedance measurements while maintaining unobstructed optical access to the tissue culture region. Experiments confirmed leak-free fluid flow across the stacked microfluidic channels and stable sensitivity of TiN electrodes to PBS. The TEER module retains optical transparency, bi-ocompatibility, and industrial scalability, supporting advanced in situ tissue barrier assessments in standardized OoC systems.
| Original language | English |
|---|---|
| Title of host publication | 2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) |
| Pages | 1335-1338 |
| Number of pages | 4 |
| Edition | 2025 |
| ISBN (Electronic) | 979-8-3315-1381-8 |
| DOIs | |
| Publication status | Published - 19 Aug 2025 |
| Event | 23rd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2025 - Orlando, United States Duration: 29 Jun 2025 → 3 Jul 2025 Conference number: 23 |
Publication series
| Name | International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers |
|---|---|
| Publisher | IEEE |
| ISSN (Print) | 2167-0013 |
Conference
| Conference | 23rd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2025 |
|---|---|
| Abbreviated title | Transducers 2025 |
| Country/Territory | United States |
| City | Orlando |
| Period | 29/06/25 → 3/07/25 |
Keywords
- 2026 OA procedure
- microfluidic platform technologies
- organ-on-chip
- standardization
- trans-epithelial electrical resistance
- Barrier-on-chip
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