Integrated wafer-through fluidic connection for surface channel technology

Jarno Groenesteijn, Meint J. de Boer, Theodorus S.J. Lammerink, Joost Conrad Lötters, Remco J. Wiegerink

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

Abstract

A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.
Original languageUndefined
Title of host publicationProceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012
Place of PublicationIlmenau, Germany
PublisherVerlag ISLE, Betriebsstatte des ISLE e.V.
PagesA03#
Number of pages4
ISBN (Print)978-3-938843-71-0
Publication statusPublished - 9 Sep 2012
Event23rd Micromechanics and Microsystems Europe Workshop, MME 2012 - Ilmenau, Germany
Duration: 9 Sep 201212 Sep 2012
Conference number: 23

Publication series

Name
PublisherVerlag ISLE, Betriebsstätte des ISLE e.V.

Workshop

Workshop23rd Micromechanics and Microsystems Europe Workshop, MME 2012
Abbreviated titleMME
CountryGermany
CityIlmenau
Period9/09/1212/09/12

Keywords

  • Surface channel technology
  • EWI-22514
  • METIS-289783
  • IR-82164
  • access holes

Cite this

Groenesteijn, J., de Boer, M. J., Lammerink, T. S. J., Lötters, J. C., & Wiegerink, R. J. (2012). Integrated wafer-through fluidic connection for surface channel technology. In Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012 (pp. A03#). Ilmenau, Germany: Verlag ISLE, Betriebsstatte des ISLE e.V..
Groenesteijn, Jarno ; de Boer, Meint J. ; Lammerink, Theodorus S.J. ; Lötters, Joost Conrad ; Wiegerink, Remco J. / Integrated wafer-through fluidic connection for surface channel technology. Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Ilmenau, Germany : Verlag ISLE, Betriebsstatte des ISLE e.V., 2012. pp. A03#
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abstract = "A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.",
keywords = "Surface channel technology, EWI-22514, METIS-289783, IR-82164, access holes",
author = "Jarno Groenesteijn and {de Boer}, {Meint J.} and Lammerink, {Theodorus S.J.} and L{\"o}tters, {Joost Conrad} and Wiegerink, {Remco J.}",
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month = "9",
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isbn = "978-3-938843-71-0",
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Groenesteijn, J, de Boer, MJ, Lammerink, TSJ, Lötters, JC & Wiegerink, RJ 2012, Integrated wafer-through fluidic connection for surface channel technology. in Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Verlag ISLE, Betriebsstatte des ISLE e.V., Ilmenau, Germany, pp. A03#, 23rd Micromechanics and Microsystems Europe Workshop, MME 2012, Ilmenau, Germany, 9/09/12.

Integrated wafer-through fluidic connection for surface channel technology. / Groenesteijn, Jarno; de Boer, Meint J.; Lammerink, Theodorus S.J.; Lötters, Joost Conrad; Wiegerink, Remco J.

Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Ilmenau, Germany : Verlag ISLE, Betriebsstatte des ISLE e.V., 2012. p. A03#.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

TY - GEN

T1 - Integrated wafer-through fluidic connection for surface channel technology

AU - Groenesteijn, Jarno

AU - de Boer, Meint J.

AU - Lammerink, Theodorus S.J.

AU - Lötters, Joost Conrad

AU - Wiegerink, Remco J.

PY - 2012/9/9

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N2 - A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.

AB - A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.

KW - Surface channel technology

KW - EWI-22514

KW - METIS-289783

KW - IR-82164

KW - access holes

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BT - Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012

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Groenesteijn J, de Boer MJ, Lammerink TSJ, Lötters JC, Wiegerink RJ. Integrated wafer-through fluidic connection for surface channel technology. In Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Ilmenau, Germany: Verlag ISLE, Betriebsstatte des ISLE e.V. 2012. p. A03#