Integrated wafer-through fluidic connection for surface channel technology

Jarno Groenesteijn, Meint J. de Boer, Theodorus S.J. Lammerink, Joost Conrad Lötters, Remco J. Wiegerink

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    Abstract

    A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.
    Original languageUndefined
    Title of host publicationProceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012
    Place of PublicationIlmenau, Germany
    PublisherVerlag ISLE, Betriebsstatte des ISLE e.V.
    PagesA03#
    Number of pages4
    ISBN (Print)978-3-938843-71-0
    Publication statusPublished - 9 Sep 2012
    Event23rd Micromechanics and Microsystems Europe Workshop, MME 2012 - Ilmenau, Germany
    Duration: 9 Sep 201212 Sep 2012
    Conference number: 23

    Publication series

    Name
    PublisherVerlag ISLE, Betriebsstätte des ISLE e.V.

    Workshop

    Workshop23rd Micromechanics and Microsystems Europe Workshop, MME 2012
    Abbreviated titleMME
    CountryGermany
    CityIlmenau
    Period9/09/1212/09/12

    Keywords

    • Surface channel technology
    • EWI-22514
    • METIS-289783
    • IR-82164
    • access holes

    Cite this

    Groenesteijn, J., de Boer, M. J., Lammerink, T. S. J., Lötters, J. C., & Wiegerink, R. J. (2012). Integrated wafer-through fluidic connection for surface channel technology. In Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012 (pp. A03#). Ilmenau, Germany: Verlag ISLE, Betriebsstatte des ISLE e.V..
    Groenesteijn, Jarno ; de Boer, Meint J. ; Lammerink, Theodorus S.J. ; Lötters, Joost Conrad ; Wiegerink, Remco J. / Integrated wafer-through fluidic connection for surface channel technology. Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Ilmenau, Germany : Verlag ISLE, Betriebsstatte des ISLE e.V., 2012. pp. A03#
    @inproceedings{6c170debd1264f0cb865f172d5931745,
    title = "Integrated wafer-through fluidic connection for surface channel technology",
    abstract = "A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.",
    keywords = "Surface channel technology, EWI-22514, METIS-289783, IR-82164, access holes",
    author = "Jarno Groenesteijn and {de Boer}, {Meint J.} and Lammerink, {Theodorus S.J.} and L{\"o}tters, {Joost Conrad} and Wiegerink, {Remco J.}",
    year = "2012",
    month = "9",
    day = "9",
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    isbn = "978-3-938843-71-0",
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    Groenesteijn, J, de Boer, MJ, Lammerink, TSJ, Lötters, JC & Wiegerink, RJ 2012, Integrated wafer-through fluidic connection for surface channel technology. in Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Verlag ISLE, Betriebsstatte des ISLE e.V., Ilmenau, Germany, pp. A03#, 23rd Micromechanics and Microsystems Europe Workshop, MME 2012, Ilmenau, Germany, 9/09/12.

    Integrated wafer-through fluidic connection for surface channel technology. / Groenesteijn, Jarno; de Boer, Meint J.; Lammerink, Theodorus S.J.; Lötters, Joost Conrad; Wiegerink, Remco J.

    Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Ilmenau, Germany : Verlag ISLE, Betriebsstatte des ISLE e.V., 2012. p. A03#.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    TY - GEN

    T1 - Integrated wafer-through fluidic connection for surface channel technology

    AU - Groenesteijn, Jarno

    AU - de Boer, Meint J.

    AU - Lammerink, Theodorus S.J.

    AU - Lötters, Joost Conrad

    AU - Wiegerink, Remco J.

    PY - 2012/9/9

    Y1 - 2012/9/9

    N2 - A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.

    AB - A new method to integrate fluidic access to devices made by surface channel technology is proposed. The method uses a high aspect-ratio DRIE process for etching wafer through trenches to allow access to the front side of the surface channel device. LPCVD of TEOS is used as etch-stop and to define a reliable connection between channel and access trench during fabrication. The resulting connection is robust and increases design freedom for the surface channel technology. The complete fluid path has only one wetting material.

    KW - Surface channel technology

    KW - EWI-22514

    KW - METIS-289783

    KW - IR-82164

    KW - access holes

    M3 - Conference contribution

    SN - 978-3-938843-71-0

    SP - A03#

    BT - Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012

    PB - Verlag ISLE, Betriebsstatte des ISLE e.V.

    CY - Ilmenau, Germany

    ER -

    Groenesteijn J, de Boer MJ, Lammerink TSJ, Lötters JC, Wiegerink RJ. Integrated wafer-through fluidic connection for surface channel technology. In Proceedings of the 23rd Micromechanics and Microsystems Europe Workshop, MME 2012. Ilmenau, Germany: Verlag ISLE, Betriebsstatte des ISLE e.V. 2012. p. A03#