Interconnects and On-Chip Data Communication Techniques

E. Mensink; Daniel Schinkel; Eric A.M. Klumperink; Adrianus Johannes Maria van Tuijl

Interconnects and On-Chip Data Communication Techniques

E. Mensink, Daniel Schinkel, Eric A.M. Klumperink, Adrianus Johannes Maria van Tuijl

Research output: Contribution to conference › Paper › Academic

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Abstract

Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In this paper, a ‘mixed-signal’ approach is taken to analyze on-chip interconnects and it is investigated how data-rates can be improved. It is shown that complex signaling schemes such as OFDM and CDMA are not efficient to improve the data-rate, while equalization can significantly improve the achievable data-rate. A combination of an equalizing transmitter with a low-ohmic receiver can improve the achievable data-rate by about a factor of 7.

Original language	Undefined
Pages	556-561
Number of pages	6
Publication status	Published - Nov 2004
Event	15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004 - Veldhoven, Netherlands Duration: 25 Nov 2004 → 26 Nov 2004 Conference number: 15

Conference

Conference	15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004
Abbreviated title	ProRisc
Country	Netherlands
City	Veldhoven
Period	25/11/04 → 26/11/04

Keywords

Communication
IR-59505
EWI-14490
mixed signal communication techniques
Interconnect
CMOS
On-chip

Access to Document

Mensink04interconnects
open

http://eprints.eemcs.utwente.nl/secure2/14490/01/mensink1.pdf

Cite this

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title = "Interconnects and On-Chip Data Communication Techniques",

abstract = "Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In this paper, a {\textquoteleft}mixed-signal{\textquoteright} approach is taken to analyze on-chip interconnects and it is investigated how data-rates can be improved. It is shown that complex signaling schemes such as OFDM and CDMA are not efficient to improve the data-rate, while equalization can significantly improve the achievable data-rate. A combination of an equalizing transmitter with a low-ohmic receiver can improve the achievable data-rate by about a factor of 7.",

keywords = "Communication, IR-59505, EWI-14490, mixed signal communication techniques, Interconnect, CMOS, On-chip",

author = "E. Mensink and Daniel Schinkel and Klumperink, {Eric A.M.} and {van Tuijl}, {Adrianus Johannes Maria}",

year = "2004",

month = nov,

language = "Undefined",

pages = "556--561",

note = "null ; Conference date: 25-11-2004 Through 26-11-2004",

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TY - CONF

T1 - Interconnects and On-Chip Data Communication Techniques

AU - Mensink, E.

AU - Schinkel, Daniel

AU - Klumperink, Eric A.M.

AU - van Tuijl, Adrianus Johannes Maria

N1 - Conference code: 15

PY - 2004/11

Y1 - 2004/11

N2 - Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In this paper, a ‘mixed-signal’ approach is taken to analyze on-chip interconnects and it is investigated how data-rates can be improved. It is shown that complex signaling schemes such as OFDM and CDMA are not efficient to improve the data-rate, while equalization can significantly improve the achievable data-rate. A combination of an equalizing transmitter with a low-ohmic receiver can improve the achievable data-rate by about a factor of 7.

AB - Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In this paper, a ‘mixed-signal’ approach is taken to analyze on-chip interconnects and it is investigated how data-rates can be improved. It is shown that complex signaling schemes such as OFDM and CDMA are not efficient to improve the data-rate, while equalization can significantly improve the achievable data-rate. A combination of an equalizing transmitter with a low-ohmic receiver can improve the achievable data-rate by about a factor of 7.

KW - Communication

KW - IR-59505

KW - EWI-14490

KW - mixed signal communication techniques

KW - Interconnect

KW - CMOS

KW - On-chip

M3 - Paper

SP - 556

EP - 561

Y2 - 25 November 2004 through 26 November 2004

ER -