Intermetallic Bonding as an Alternative to Polymeric Adhesives in Ultrasound Transducers

Per Kristian Bolstad, Duy Le-Anh, Lars Hoff, Tung Manh

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)

Abstract

Common ultrasound transducers utilize epoxy for bonding the active piezoelectric to the rest of the acoustic stack. This paper explores some of the potential benefits of replacing this soft epoxy layer with a harder metallurgical bond. The influence of varying the bond layer thickness was evaluated for epoxy- and intermetallic bonding layers in an ultrasound transducer, as was the effect of voids and delamination that may occur during fabrication of intermetallic bonds. It was found that the intermetallic bond could be made much thicker than an epoxy bond without degrading the transducer performance, and the influence by thickness variations was less. Small voids in the intermetallic where shown to cause a downshift in resonance frequency, whereas regions with delamination will cause reflections that degrade the performance of the transducer.

Original languageEnglish
Title of host publication2019 IEEE International Ultrasonics Symposium, IUS 2019
PublisherIEEE Computer Society Press
Pages1765-1768
Number of pages4
ISBN (Electronic)9781728145969
DOIs
Publication statusPublished - Oct 2019
Event2019 IEEE International Ultrasonics Symposium, IUS 2019 - Glasgow, United Kingdom
Duration: 6 Oct 20199 Oct 2019

Publication series

NameIEEE International Ultrasonics Symposium, IUS
Volume2019-October
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

Conference2019 IEEE International Ultrasonics Symposium, IUS 2019
Abbreviated titleIUS 2019
CountryUnited Kingdom
CityGlasgow
Period6/10/199/10/19

Keywords

  • Bonding Techniques
  • Intermetallics
  • Modelling
  • Transducers
  • Ultrasound

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